参数资料
型号: XF2M-4215-1A
厂商: Omron Electronics Inc-EMC Div
文件页数: 7/28页
文件大小: 0K
描述: CONN FPC 42POS 0.5MM PITCH SMD
产品培训模块: FPC Connectors
产品目录绘图: XF2M Series
标准包装: 1
系列: XF2M
连接器类型: 顶部和底部触点
位置数: 42
间距: 0.020"(0.50mm)
FFC,FCB 厚度: 0.30mm
板上方高度: 0.083"(2.10mm)
安装类型: 表面贴装,直角
线缆端类型: 直形
端子: 焊接
锁定功能: 旋转锁,背锁
包装: 标准包装
触点表面涂层:
触点涂层厚度: 5.9µin(0.15µm)
工作温度: -30°C ~ 85°C
额定电流: 0.500A
额定电压: 50V
体座材料: 液晶聚合物(LCP)
产品目录页面: 77 (CN2011-ZH PDF)
其它名称: OR730DKR
Rotary Backlock Connector
(0.3-mm Pitch, Double-sided Contact)
Rotary Backlock Mechanism with 0.3-mm Pitch
? Wide molding wall on the rear bottom of the connector allows greater
freedom in board design.
? Double-sided contact reduces the number of parts.
? Gold plated with an applicable FPC thickness of 0.2 mm.
RoHS Compliant
XF2B
■ Ratings and Specifications
■ Materials and Finish
Rated current
0.2 A AC/DC
Housing LCP resin (UL94V-0)/natural
Rated voltage
50 V AC/DC
Slider
LCP resin (UL94V-0)/black
Contact resistance 50 m Ω max. (at 20 mV max., 100 mA max.)
Insulation resistance 100 M Ω min. (at 250 V DC)
250 V AC for 1 min.
Withstand voltage
(leakage current: 1 mA max.)
Insertion tolerance
20 times
? 30 to 85 ° C
Ambient operating
temperature
(with no icing or condensation)
Contacts
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
■ Dimensions
XF2B- @@ 45-31A
PCB Mating Dimensions (Top View)
(1.4)
0.3
0.6
A
0.15
0.6 ±0.05
A ±0.05
0.3 ±0.05
0.75 ±0.05
5.4 ±0.1
0.3 ±0.05
0.75 ±0.05
0.6 ±0.05
B ±0.05
0.3 ±0.05
(1.1)
0.6
B
D
0.12
0.5
Applicable FPC Dimensions
0.3 +0.04
1.2
2.1
0.6 ±0.02
A ±0.03
? 0.03
1.6
C
Table of Dimensions
0.1
0.55
5.2
5.5
0.5
1.23
2
1.2 1
4.5
(Reinforcement board)
2.5 ±0.03
(Effective interface length)
0.8 (Effective interface length)
0.6 ±0.02 0.3 +0.04
Pins (See note 1.)                Model
17 XF2B-1745-31A
21 XF2B-2145-31A
23
XF2B-2345-31A
25
XF2B-2545-31A
27
XF2B-2745-31A
31
XF2B-3145-31A
33
XF2B-3345-31A
35
XF2B-3545-31A
39
XF2B-3945-31A
41
XF2B-4145-31A
45
XF2B-4545-31A
51
XF2B-5145-31A
61
XF2B-6155-31A
A
4.2
5.4
6.0
6.6
7.2
8.4
9.0
9.6
10.8
11.4
12.6
14.4
17.4
B
4.8
6.0
6.6
7.2
7.8
9.0
9.6
10.2
11.4
12.0
13.2
15.0
18.0
C
5.5
6.7
7.3
7.9
8.5
9.7
10.3
10.9
12.1
12.7
13.9
15.7
18.7
D
7.0
8.2
8.8
9.4
10.0
11.2
11.8
12.4
13.6
14.2
15.4
17.2
20.2
0.25
0.3 ±0.07
0.3 ±0.02
? 0.03
B ±0.03
(B+0.6) ±0.05
Two, R0.2 max.
T=0.2±0.03
(Conductive plating)
7
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