参数资料
型号: XF3H-1355-31A
厂商: Omron Electronics Inc-EMC Div
文件页数: 24/28页
文件大小: 0K
描述: CONN FPC 13POS 0.3MM PITCH SMD
产品培训模块: Medical Solutions
产品变化通告: XF3H Series Plating Change May/2012
标准包装: 1
系列: XF3H
连接器类型: 底部触点
位置数: 13
间距: 0.012"(0.30mm)
FFC,FCB 厚度: 0.20mm
板上方高度: 0.036"(0.90mm)
安装类型: 表面贴装,直角
线缆端类型: 直形
端子: 焊接
锁定功能: 旋转锁
包装: 标准包装
触点表面涂层:
触点涂层厚度: 5.9µin(0.15µm)
工作温度: -30°C ~ 85°C
额定电流: 0.200A
额定电压: 50V
体座材料: 液晶聚合物(LCP)
其它名称: OR1055DKR
XF
4. When unlocking the slider (lever), place your fingers on
either side or the entire slider (lever) and slowly lift the
XF
? Removing the FPC by pulling it up and down or from left
to right or twisting it sideways.
slider (lever) up and away.
6. Make sure that the FPC has been inserted correctly and
not backward.
Inserting the FPC incorrectly with the connecting face not
aligned with the customer's design specification may
damage the contacts and equipment may malfunction.
Mounting
1. Do not perform reflow or manual soldering with the FPC
Do not engage the slider (lever) past its initial location
during the unlocking process. Doing so may result in
damage to the connector or contact failure.
Primary location
Performing the following action may cause the terminals
to change shape or otherwise cause contact failures.
? Using tweezers to unlock the slider (lever).
5. When inserting and removing the FPC, be sure to check
that the slider (lever) has been unlocked first.
inserted in the connector and the slider (lever) in the
locked position. Doing so may result in contact failure.
2. The reflow conditions are as stated in OMRON’s specifi-
cations and guidelines. These conditions, however,
depend on the type of solder, the manufacturer, the
amount of solder, the size of the circuit board, and the
other mounting materials. Confirm the mounting condi-
tions before proceeding.
Designing
1. Gently pull out the FPC taking care not to apply force
directly to the connector. Bending the FPC in the area
where it enters the connector or applying force to the FPC
itself may result in contact failure.
2. When installing the FPC at a location or on equipment
that will subject the FPC to repeated vibration or move-
ment, secure the FPC prior to use.
3. Use the FPCs that conform to the appropriate specifica-
tions and size as stated by OMRON. When using a differ-
ent FPC, or an F/F, contact OMRON.
4. Use the same metal for the FPC plating and the connec-
tor plating.
5. “Whiskers” may protrude from the FOC film of some lead-
free FPCs. Be careful when using these units.
6. When designing the board, be sure to allow locking and
operating space for the slider (lever).
Using the FPC in the follow ways may damage the FPC,
24
change the shape of the contacts, or result in contact fail-
ure.
? Removing the FPC when the slider (lever) is still locked.
Component
7. Make sure that the metal mask thickness is within the
appropriate specifications and size as stated by OMRON.
The recommended metal mask open area is 90% of the
printed circuit board mating dimensions given in the
dimensions diagrams.
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