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参数资料
| 型号： | XLT08SO |
| 厂商： | Microchip Technology |
| 文件页数： | 3/42页 |
| 文件大小： | 0K |
| 描述： | SOCKET TRANSITION ICE 8SOIC |
| 标准包装： | 3 |
| 附件类型： | 转换插槽 |
| 适用于相关产品： | MPLAB?ICE |
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Transition Socket Specification
INTRODUCTION
Transition sockets are products that allow header
boards (for next generation in-circuit emulators or
in-circuit debuggers) or device adapters (for the
MPLAB ICE 2000 in-circuit emulator) to interface to
sockets on target applications.
Typically, header boards or device adapters have con-
nectors that match development cycle device formats,
such as DIP or PLCC. However, target sockets will
match compact production device formats, such as
SOIC, SSOP, QFP, or QFN. The solution is transition
sockets. A transition socket is specifically designed to
provide compatibility between two differing types of IC
package formats.
Transition sockets are typically composed of two parts:
the adapter socket and the adapter header. The
adapter socket is designed to plug into the header
board or device adapter on one side, and the adapter
header on the other. The adapter header is then
soldered down to the target application.
WHY SHOULD I USE TRANSITION
SOCKETS IN MY PRODUCT DESIGN?
There are two very significant advantages to using
transition sockets:
WHAT TRANSITION SOCKETS ARE
CURRENTLY AVAILABLE?
Microchip Technology currently offers the transition
sockets listed in the “Table of Contents” following this
introductory section.
Use the on-line Development Tools Selector (DTS) to
find the transition sockets available for each header
board or for each device adapter. For more on header
boards or device adapters, see:
? Header Board Specification (DS51292)
? MPLAB ? ICE 2000 Processor Module and Device
Adapter Specification (DS51140)
? MPLAB ? ICE 4000 Processor Module and Device
Adapter Specification (DS51298)
Please see the Microchip web site
(www.microchip.com) for the DTS and most current
version of all documents.
HOW CAN I OBTAIN MAXIMUM
BENEFIT FROM THE USE OF
TRANSITION SOCKETS?
Attention to component placement should be
considered to provide adequate clearance for the
transition socket interface to the PCB footprint. This is
1.
Shorter product development cycle
especially true for any tall components such as connec-
2. Reduced expense in the design, layout and
prototype testing
A typical product design cycle has two important
phases: the prototype design phase and the production
design phase. Traditionally, these phases were differ-
ent simply because the prototype used a microcon-
troller with a different package type. However, with the
availability of the transition sockets, the prototype
design can be identical to the production design
because a transition socket can be used to bridge
microcontroller package differences.
? 2010 Microchip Technology Inc.
tor headers, radial components or voltage regulators.
Refer to the transition socket mechanical drawings for
dimensions.
DS51194S-page 3
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| VE-JVX-EZ-F1 | CONVERTER MOD DC/DC 5.2V 25W |
| VE-JVX-EY-S | CONVERTER MOD DC/DC 5.2V 50W |
| DVA16XP640 | ADAPTER DEVICE FOR MPLAB-ICE |
| VE-JVV-EZ-F4 | CONVERTER MOD DC/DC 5.8V 25W |
| RMM10DRKS | CONN EDGECARD 20POS DIP .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XLT08SO-1 | 功能描述:插座和适配器 Small Outline Transition Socket RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
| XLT12-6 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Thermoelectric Cooler |
| XLT12-6-00L | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Thermoelectric Cooler |
| XLT12-6-01L | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Thermoelectric Cooler |
| XLT14SO | 功能描述:插座和适配器 14 LD(150&208 mil) Sm Outline Tran Sckt RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
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