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| 型号： | XLT14SS-1 |
| 厂商： | Microchip Technology |
| 文件页数： | 4/42页 |
| 文件大小： | 0K |
| 描述： | SOCKET TRANSITION 14DIP/14SSOP |
| 标准包装： | 1 |
| 模块/板类型： | * |
| 适用于相关产品： | MPLAB?ICE |
| 产品目录页面： | 658 (CN2011-ZH PDF) |
| 配用： | AC162096-ND - HEADER MPLAB ICD2 PIC16F526 8/14 AC162083-ND - HEADER MPLAB ICD2 PIC16F616 8/14 AC162066-ND - HEADER INTRFC MPLAB ICD2 20PIN DVA1004-ND - DEVICE ADAPTER 8/14/20DIP AC162057-ND - MPLAB ICD 2 HEADER 14DIP |
| 相关产品： | PIC16HV610-E/ST-ND - IC PIC MCU FLASH 1KX14 14TSSOP PIC16HV610-I/ST-ND - IC PIC MCU FLASH 1KX14 14TSSOP PIC16HV610T-I/STTR-ND - IC PIC MCU FLASH 1KX14 14TSSOP PIC16HV616T-I/ST-ND - IC PIC MCU FLASH 2KX14 14TSSOP PIC16F688T-I/ST-ND - IC MCU PIC FLASH 4KX14 14TSSOP PIC16F688T-E/ST-ND - IC MCU PIC FLASH 4KX14 14TSSOP PIC16F688-E/ST-ND - IC MCU FLASH 4KX14 14TSSOP PIC16F636T-I/ST-ND - IC MCU FLASH 2KX14 14TSSOP PIC16F505-E/SL-ND - IC MCU FLASH 1KX12 14SOIC PIC16F688-I/ST-ND - IC PIC MCU FLASH 4KX14 14TSSOP 更多... |
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Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers.
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
Care should be taken when soldering some transition
sockets to target boards. See the releated section for
specific instructions.
For information on packaging dimensions, please refer
to the Packaging Specification (DS00049).
DS51194S-page 4
GLOSSARY
Terms used in this document:
DFN – Dual Flat No lead
DIP – Dual In-line Package
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
? 2010 Microchip Technology Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XLT16QFN1 | 功能描述:插座和适配器 Transition Socket RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
| XLT18SO | 功能描述:插座和适配器 18 LD Sm. Outline Trans. Socket RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
| XLT18SO-1 | 功能描述:插座和适配器 Small Outline Transition Socket RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
| XLT20QFN-1 | 功能描述:插座和适配器 20P DIP to 20L QFN Target RoHS:否 制造商:Silicon Labs 产品:Adapter 用于:EM35x |
| XLT20S01 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:20PIN- 300MIL SO TRANS SKT |
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