参数资料
型号: XLT18SO-1
厂商: Microchip Technology
文件页数: 35/42页
文件大小: 0K
描述: SOCKET TRANSITION 18SOIC 300MIL
标准包装: 1
模块/板类型: *
适用于相关产品: MPLAB?ICE
产品目录页面: 658 (CN2011-ZH PDF)
配用: AC162083-ND - HEADER MPLAB ICD2 PIC16F616 8/14
DVA1006-ND - DEVICE ADAPTER ICE2000 18DIP
DVA1001-ND - ADAPTER FOR PIC16F716 18DIP
DAF18-4-ND - DEVICE ADAPTER FOR ICE4000
AC162054-ND - HEADER INTERFACE ICD2 16F716
DVA18XP180-ND - DEVICE ADAPTER 18F1320 PDIP 18LD
AC162053-ND - HEADER INTERFACE ICD,ICD2 18DIP
DVA16XP185-ND - ADAPTER DEVICE ICE 18DIP/SOIC
DVA16XP183-ND - ADAPTER ICE 18DIP/SOIC/SSOP
DVA16XP182-ND - ADAPTR 712,716 DIP,SOIC,SSOP
更多...
相关产品: PIC16F785-I/SO-ND - IC PIC MCU FLASH 2KX14 20SOIC
PIC16F689-I/SO-ND - IC PIC MCU FLASH 4KX14 20SOIC
DSPIC30F2011-20E/SO-ND - IC DSPIC MCU/DSP 12K 18SOIC
DSPIC30F301230ISO-ND - IC DSPIC MCU/DSP 24K 18SOIC
DSPIC30F301220ISO-ND - IC DSPIC MCU/DSP 24K 18SOIC
DSPIC30F201130ISO-ND - IC DSPIC MCU/DSP 12K 18SOIC
DSPIC30F201120ISO-ND - IC DSPIC MCU/DSP 12K 18SOIC
PIC16F54-I/SO-ND - IC MCU FLASH 512X12 18SOIC
PIC16F716-I/SO-ND - IC PIC MCU FLASH 2KX14 18SOIC
PIC16F648A-I/SO-ND - IC MCU FLASH 4KX14 EEPROM 18SOIC
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Transition Socket Specification
QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets and
associated hardware are shown below.
FIGURE 5: QFP TRANSITION SOCKET
Cable to Processor Module
QFP Device Adapter
QFP Transition Socket
Target/Application Board
The QFP transition socket is required for use along with
the QFP device adapter. The device adapter is
equipped with four socket strips that interface with the
transition socket.
QFP TRANSITION SOCKET
SOLDERING TIPS
? Before soldering, consider keeping the
break-away tabs in place during soldering.
? Use controlled soldering iron tip temperatures
between 300 ? C and 325 ? C (570 ? F to 615 ? F)
? If possible, use a PACE mini wave soldering iron
tip or an equivalent tip design.
? Plan to solder one (1 of 4) side first, then the
opposite side, then the remaining two sides.
? Soldering iron tip movement should be in the
direction of the leads (backward and forward), not
across the leads; dragging the tip across the
leads may cause lead damage.
? Use generous amounts of soldering flux to aid in
Note:
To avoid solder bridging, do not place vias
within 0.025-inch of the QFP footprint.
Also, any vias near the QFP should be
directly on the centerline of the pad.
the solder flow action.
? If the break-away tabs are removed after solder-
ing (using a dental pick or equivalent), any solder
bridging between leads can be repaired by simply
gently touching the soldering tip to the lead tip.
The following QFP transition sockets have been
discontinued:
? XLT44PT: One 44-lead QFP transition socket,
0.80 mm
? XLT64PT1: One 64-lead QFP transition socket,
0.5 mm (PIC16C92X)
CAUTION
The 64 and 80-pin QFP headers are very delicate
and can be easily damaged!
XLT44PT (Discontinued – see XLT44PT3)
Note:
Pin 1
The XLT64PT1 for the PIC16C92X is not
symmetrical. Please note Pin 1 orientation
prior to soldering to the target system.
1
ST92X
44-lead QFP to 0.8 mm Adapter Socket
TOP
0.90
VIEW
TOP
VIEW
0.90
0.80
? XLT64PT2: One 64-lead QFP transition socket,
0.5 mm (PIC17CXXX)
? XLT64PT3: One 64-lead QFP transition socket,
0.8 mm (dsPIC30F)
FRONT/
SIDE
VIEW
0.05
0.300
? XLT64PT4: One 64-lead QFP adapter socket and
one 64-lead QFP header (0.8 mm)
? XLT80PT: One 80-lead QFP transition socket,
0.5 mm
? 2010 Microchip Technology Inc.
0.130
0.80 mm
0.365
0.55
0.65
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
DS51194S-page 35
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