参数资料
型号: XLT44L2
厂商: Microchip Technology
文件页数: 30/42页
文件大小: 0K
描述: SOCKET TRAN ICE 44PLCC
标准包装: 1
模块/板类型: *
适用于相关产品: MPLAB?ICE
产品目录页面: 658 (CN2011-ZH PDF)
相关产品: PIC18F452-E/L-ND - IC MCU CMOS 40MHZ 16K FLSH44PLCC
PIC18F442-E/L-ND - IC MCU CMOS 40MHZ 8K FLSH 44PLCC
PIC18F442T-I/L-ND - IC MCU FLASH 8KX16 EE A/D 44PLCC
PIC18F452-I/L-ND - IC MCU FLASH 16KX16 EE 44PLCC
PIC18F442-I/L-ND - IC MCU FLASH 8KX16 EE A/D 44PLCC
PIC18F452T-I/L-ND - IC MCU FLASH 16KX16 EE 44PLCC
其它名称: XLT44L2R
XLT44L2R-ND
Transition Socket Specification
SSOP TRANSITION SOCKET
An SSOP transition socket and associated hardware is
XLT14SS (Discontinued – see XLT14SS-1)
14-lead DIP to 0.8 mm Adapter Socket
shown in Figure 3.
TOP
FIGURE 3: SSOP TRANSITION SOCKET
VIEW
Cable to Processor Module
PDIP Device Adapter
BOTTOM
Gold Standoffs/
Adapters
Adapter Socket
SSOP Transition Socket
VIEW
SSOP Header
Target/Application Board
SIDE
VIEW
The SSOP transition sockets are similar to the SOIC
transition sockets. There are two parts to the SSOP
transition socket:
FRONT/
1.
2.
Adapter socket that connects to the PDIP device
adapter.
SSOP header that gets soldered down to the
REAR
VIEW
target application.
14-lead SSOP Header
Note:
To keep the leads straight during assembly
and shipping, the SSOP headers are
shipped with break-away tabs attached to
the leads. Please remove the break-away
tabs before applying power to the target
system. Be careful not to bend the leads
prior to soldering to the target application.
The following SSOP transition sockets have been dis-
TOP
VIEW
Shipped with
break-away tabs
attached to leads
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
continued:
? XLT14SS: One adapter socket and three 14-lead
FRONT/
F
SSOP headers
? XLT20SS: One adapter socket and three 20-lead
SSOP headers
? XLT20SS1: One adapter socket and three 20-lead
REAR
VIEW
E
D
SSOP headers
? XLT28SS: One adapter socket and three 28-lead
SSOP headers
? XLT28SS2: One adapter socket and three 28-lead
SSOP headers for PIC16C55/57
See the drawings in this section for layout dimensions
and clearances for tall components.
G
C
SIDE
VIEW
A
B
A
0.035
B
0.300
C
0.023
D
0.080
E
0.186
F
0.043
G
0.025
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break-away tabs are to be removed prior to providing power.
DS51194S-page 30
? 2010 Microchip Technology Inc.
相关PDF资料
PDF描述
GBC35DRXH-S734 CONN EDGECARD 70POS DIP .100 SLD
DVA16XP182 ADAPTR 712,716 DIP,SOIC,SSOP
GSC10DREF-S734 CONN EDGECARD 20POS .100 EYELET
TT9GYX PATCHCORD SGL 3COND GRAY 9FT
GMC10DREF-S734 CONN EDGECARD 20POS .100 EYELET
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