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| 型号： | XPC850VR80BU |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 67/72页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 80MHZ 256-PBGA |
| 标准包装： | 60 |
| 系列： | MPC8xx |
| 处理器类型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 80MHz |
| 电压： | 3.3V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-PBGA（23x23） |
| 包装： | 托盘 |
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MPC850 PowerQUICC Integrated Communications Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
7
Electrical and Thermal Characteristics
— Separate power supply input to operate internal logic at 2.2 V when operating at or below
25 MHz
— Can be dynamically shifted between high frequency (3.3 V internal) and low frequency (2.2 V
internal) operation
Debug interface
— Eight comparators: four operate on instruction address, two operate on data address, and two
operate on data
— The MPC850 can compare using the =,
≠, <, and > conditions to generate watchpoints
— Each watchpoint can generate a breakpoint internally
3.3-V operation with 5-V TTL compatibility on all general purpose I/O pins.
3
Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC850.
Table 2 provides the maximum ratings.
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or VCC). Table 3 provides
the package thermal characteristics for the MPC850.
Table 2. Maximum Ratings
(GND = 0V)
Rating
Symbol
Value
Unit
Supply voltage
VDDH
-0.3 to 4.0
V
VDDL
-0.3 to 4.0
V
KAPWR
-0.3 to 4.0
V
VDDSYN
-0.3 to 4.0
V
Input voltage 1
1
Functional operating conditions are provided with the DC electrical specifications in Table 5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
CAUTION: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction
applies to power-up and normal operation (that is, if the MPC850 is unpowered, voltage greater than 2.5 V must not
be applied to its inputs).
Vin
GND-0.3 to VDDH + 2.5 V
V
Junction temperature 2
2
The MPC850, a high-frequency device in a BGA package, does not provide a guaranteed maximum ambient
temperature. Only maximum junction temperature is guaranteed. It is the responsibility of the user to consider power
dissipation and thermal management. Junction temperature ratings are the same regardless of frequency rating of
the device.
Tj
0 to 95 (standard)
-40 to 95 (extended)
°C
Storage temperature range
Tstg
-55 to +150
°C
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XPC850ZT50B | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:Communications Controller Hardware Specifications |
| XPC850ZT50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC8xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
| XPC850ZT66B | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| XPC850ZT66BU | 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC8xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
| XPC850ZT80B | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:Communications Controller Hardware Specifications |
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