参数资料
型号: XPEHEW-H1-0000-00EF6
厂商: Cree Inc
文件页数: 1/13页
文件大小: 1251K
描述: LED XLAMP XPE HIEFF WHITE SMD
产品培训模块: XLamp XP-E High Efficiency White LED
标准包装: 1,000
系列: Xlamp® XP-E HEW
颜色: 中性白
电流 - 最大: 1A
正向电压: 3.0V
流明 @ 电流 - 最大: 271 lm
在特定电流下的光通量 - 测试: 118 lm
流明/瓦 @ 电流 - 测试: 112 lm/W
电流 - 测试: 350mA
波长: 3700K
透镜样式/尺寸: 圆形,带圆顶,2.5mm
视角: 120°
安装类型: 表面贴装
封装/外壳: 2-SMD,无引线,裸露焊盘
包装: 带卷 (TR)
Product family data sheet
Copyright ? 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
Cree?, the Cree logo and XLamp?
are registered trademarks of Cree, Inc.
CLD-DS34 Rev 4A
cree?
X
lamp?
XP-E High-Effciency White LEDs
Product
descriPtioN
XLamp XP-E High-Effciency White
LeDs upgrade the XLamp XP-e
to leading performance levels ?
for diffuse lighting applications.
XP-E HEW is designed to enable
faster adoption of LeD light in ?
cost-sensitive, consumer lighting
products. Compared to the standard
?
XLamp XP-E, XP-E HEW can reduce
LeD count by 50% and still deliver
the same system performance.
Cree XLamp LeDs bring high ?
performance and quality of light to a
wide range of lighting applications,
including color-changing, portable
and personal, outdoor, indoor-
directional, transportation, stage
and studio, commercial and
emergency-vehicle lighting.
features
?
Light output and effcacy similar
to XLamp XP-G
Maximum drive current:
1000
mA
?
Low thermal resistance: 6
°C/W
Maximum junction temperature:
Temperature............................4
150
°C
Wide viewing angle: 120°
?
Refow solderable - JEDEC
J-STD-020C compatible
?
electrically neutral thermal path
Relative Chromaticity vs.
?
RoHS- and ReACh-compliant
UL-recognized component
(e349212)
taBle
of
coNteNts
WWW
.
CREE
.
C
om/X
L
am
P
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Flux Characteristics...................2
Characteristics
.........................3
Relative Spectral Power
Distribution..............................3
Relative Flux vs. Junction
electrical Characteristics............5
Relative Flux vs. Current
...........5
Relative Chromaticity vs.
Current...................................6
Temperature............................6
Typical Spatial Distribution.........7
Thermal Design........................7
Refow Soldering Characteristics.8
Notes......................................9
Mechanical Dimensions............
11
Tape and Reel
........................
12
Packaging..............................
13
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