参数资料
型号: XPEWHT-L1-0000-009E6
厂商: Cree Inc
文件页数: 5/17页
文件大小: 1623K
描述: LED WARM WHITE 700MA SMD
产品培训模块: XLamp XP-E LEDs
产品目录绘图: XPC, XPE, XPG Series Bottom
XPC, XPE, XPG Series Side
XPC, XPE, XPG Series Top
标准包装: 1,000
系列: Xlamp® XP-E
颜色: 暖白色
电流 - 最大: 1A
正向电压: 3.2V
流明 @ 电流 - 最大: 189 lm
在特定电流下的光通量 - 测试: 84 lm
流明/瓦 @ 电流 - 测试: 75 lm/W
电流 - 测试: 350mA
波长: 3500K
透镜样式/尺寸: 圆形,带圆顶,2.6mm
视角: 115°
安装类型: 表面贴装
封装/外壳: 2-SMD,无引线,裸露焊盘
包装: 带卷 (TR)
Copyright ? 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree?, the Cree logo and XLamp?
are registered
trademarks of Cree, Inc.
13
xlamp xp-e leds
refloW
solderinG
characteristics
In testing, Cree has found XLamp Xp?E LEDs to be compatible with JEDEC J?STD?020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profle provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all pCB designs and confgurations of refow soldering equipment.
Profle Feature
lead-based solder
lead-free solder
Average Ramp?Up Rate (Tsmax
to Tp)
3
°C/second max.
3
°C/second max.
preheat: Temperature Min (Tsmin)
100
°C
150
°C
preheat: Temperature Max (Tsmax)
150
°C
200
°C
preheat: Time (tsmin
to ts
max)
60-120 seconds
60-180 seconds
Time Maintained Above: Temperature (TL)
183
°C
217
°C
Time Maintained Above: Time (tL)
60-150 seconds
60-150 seconds
peak/Classifcation Temperature (Tp)
215
°C
260
°C
Time Within 5
°C of Actual Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-Down Rate
6
°C/second max.
6
°C/second max.
Time 25
°C to Peak Temperature
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
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