- 您现在的位置：买卖IC网 > PDF目录16488 > XR16M570IL24-0B-EB (Exar Corporation)EVAL BOARD FOR XR16M570-B 24QFN PDF资料下载
参数资料
| 型号： | XR16M570IL24-0B-EB |
| 厂商： | Exar Corporation |
| 文件页数： | 34/50页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR XR16M570-B 24QFN |
| 标准包装： | 1 |
| 系列： | * |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页当前第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页
XR16M570
4
1.62V TO 3.63V HIGH PERFORMANCE UART WITH 16-BYTE FIFO
REV. 1.0.1
Pin type: I=Input, O=Output, I/O= Input/output.
DSR#
-
25
C4
I
UART Data-Set-Ready (active low) or general purpose input. This
input should be connected to VCC when not used.
CD#
-
26
-
I
UART Carrier-Detect (active low) or general purpose input. This
input should be connected to VCC when not used.
RI#
-
27
-
I
UART Ring-Indicator (active low) or general purpose input. This
input should be connected to VCC when not used.
ANCILLARY SIGNALS
XTAL1
8
10
D5
I
Crystal or external clock input.
XTAL2
-
11
-
O
Crystal or buffered clock output.
PwrSave
7
-
I
Power-Save (active high). This feature isolates the M570’s data bus
interface from the host preventing other bus activities that cause
higher power drain during sleep mode. See Sleep Mode with Auto
Wake-up and Power-Save Feature section for details. This pin does
not have a pull-down resistor. This input should be connected to
GND when not used.
RESET
17
23
A2
I
This input is active high. A 40 ns minimum active pulse on this pin
will reset the internal registers and all outputs of the UART. The
UART transmitter output will be held at logic 1, the receiver input
will be ignored and outputs are reset during reset period (see UART
Reset Conditions).
VCC
19
28
B1
Pwr
1.62V to 3.63V power supply.
GND
10
13
E5
Pwr
Power supply common, ground.
GND
Center
Pad
Center
Pad
-Pwr
The center pad on the backside of the QFN package is metallic and
should be connected to GND on the PCB. The thermal pad size on
the PCB should be the approximate size of this center pad and
should be solder mask defined. The solder mask opening should be
at least 0.0025" inwards from the edge of the PCB thermal pad.
NC
-
2, 9, 15,
16
--
No Connects.
Pin Description
NAME
24-QFN
PIN#
32-QFN
PIN#
25-BGA
PIN#
TYPE
DESCRIPTION
相关PDF资料 |
PDF描述 |
|---|---|
| SPD73R-103M | INDUCTOR PWR SHIELDED 10UH SMD |
| 1906015-8 | CA 2.0MM OFNR 50/125,LC SEC GRN |
| CM252016-2R2KL | INDUCTOR CHIP 2.2UH 2520 SMD |
| 6278027-1 | C/A ST/MT-RJ, MM 1M1 |
| ECM18DSXH | CONN EDGECARD 36POS DIP .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XR16M570IL24-0C-EB | 功能描述:界面开发工具 Eval Board for XR16M570IL24 Series RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| XR16M570IL24-F | 功能描述:UART 接口集成电路 1.8 HIGH PERFORMANCE UART W/16 RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| XR16M570IL24TR-F | 功能描述:UART 接口集成电路 1.8 HIGH PERFORMANCE UART W/16 RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| XR16M570IL32 | 制造商:EXAR 制造商全称:EXAR 功能描述:1.62V TO 3.63V HIGH PERFORMANCE UART WITH 16-BYTE FIFO |
| XR16M570IL32-0A-EB | 功能描述:界面开发工具 Eval Board for XR16M570IL32 Series RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
发布紧急采购，3分钟左右您将得到回复。