参数资料
型号: XR21V1412IL-0B-EB
厂商: Exar Corporation
文件页数: 29/32页
文件大小: 0K
描述: EVAL BOARD FOR XR21V1412IL
产品培训模块: UART Product Overview
XR21V141x Full-Speed USB UART Family
标准包装: 1
主要目的: 接口,USB 2.0 至 UART
嵌入式:
已用 IC / 零件: XR21V1412IL
已供物品:
其它名称: 1016-1426
XR21V1412
6
2-CH FULL-SPEED USB UART
REV. 1.3.0
NOTE: Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
Miscellaneous Signals
LOWPOWER
2
O
Low power status output. The LOWPOWER pin will be asserted whenever it is not
safe to draw the amount of current from VBUS power requested in the Device Max
Power field of the Configuration Descriptor. The LOWPOWER pin will behave differ-
ently for a low power device and a high power device.
Low-power device (<= 1 unit load or 100 mA i.e. bMaxPower <= 0x32):
LOWPOWER pin is asserted when the USB UART is in suspend mode.
High-power deivce (bMaxPower > 0x32): LOWPOWER pin is
asserted when the USB UART is in suspend mode or when it is not yet
configured.
The LOWPOWER pin will be de-asserted whenever it is safe to draw the
amount of current requested in the Device Maximum Power field.
This pin is sampled momentarily at power-up or at any USB bus reset to configure the
polarity of the LOWPOWER output during suspend mode. An external (10K) pull-up
resistor will cause the LOWPOWER pin to be asserted HIGH during suspend mode.
An external (3.3K) pull-down resistor will cause the LOWPOWER pin to be asserted
LOW during suspend mode.
VCC
4, 13, 24,
31, 32
Pwr
+3.3V power supply.
GND
1, 3, 14,
23, 27,
28
Pwr
Power supply common, ground.
GND
Center
Pad
Pwr
The center pad on the back side of the QFN package is metallic and should be con-
nected to GND on the PCB. The thermal pad size on the PCB should be the approx-
imate size of this center pad and should be solder mask defined. The solder mask
opening should be at least 0.0025" inwards from the edge of the PCB thermal pad.
NAME
32-QFN
PIN #
TYPE
DESCRIPTION
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