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参数资料
| 型号： | XRA1404IG16-0B-EB |
| 厂商： | Exar Corporation |
| 文件页数： | 8/14页 |
| 文件大小： | 0K |
| 描述： | GPIO EXPANDER EVAL BOARD |
| 设计资源： | XRA140x Eval Board (8-Bit) Schematics |
| 标准包装： | 1 |
| 主要目的： | 接口，GPIO 扩展器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | XRA1404IG16 |
| 已供物品： | 板 |
| 其它名称： | 1016-1740 XRA1404IG16-OB-EB |
XRA1404
3
REV. 1.0.0
8-BIT SPI GPIO EXPANDER WITH INTEGRATED LEVEL SHIFTERS
PIN DESCRIPTIONS
Pin Description
NAME
PIN#
TYPE
DESCRIPTION
SPI INTERFACE
SO
13
15
O
SPI serial data output.
SCL
12
14
I
SPI serial input clock.
IRQ#
11
13
OD
Interrupt output (open-drain, active LOW).
CS#
16
2
I
SPI bus chip select.
SI
1
3
I
SPI serial data input.
GPIOs
P0
P1
P2
P3
P4
P5
P6
P7
2
3
4
5
7
8
9
10
4
5
6
7
9
10
11
12
I/O
General purpose I/Os P0-P7. All GPIOs are configured as inputs upon power-
up or after a reset.
ANCILLARY SIGNALS
VCCP
14
16
Pwr
1.65V to 3.6V VCC supply voltage for GPIOs.
VCC
15
1
Pwr
1.65V to 3.6V VCC supply voltage for SPI bus interface.
GND
6
8
Pwr
Power supply common, ground.
GND
Center
Pad
-
Pwr
The exposed pad at the bottom surface of the package is designed for thermal
performance. Use of a center pad on the PCB is strongly recommended for ther-
mal conductivity as well as to provide mechanical stability of the package on the
PCB. The center pad is recommended to be solder masked defined with open-
ing size less than or equal to the exposed thermal pad on the package bottom to
prevent solder bridging to the outer leads of the device. Thermal vias must be
connected to GND plane as the thermal pad of package is at GND potential.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
QFN-16 TSSOP-16
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XRA1404IG16-F | 功能描述:接口-I/O扩展器 8 Bit SPI GPIO Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| XRA1404IG16TR-F | 功能描述:接口-I/O扩展器 8 Bit SPI GPIO Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| XRA1404IL16-0B-EB | 功能描述:其他开发工具 8 Bit SPI Eval GPIO Expander RoHS:否 制造商:Parallax 产品:ELEV-8 Hex Upgrade Kits 类型:Robotics 工具用于评估:ELEV-8 Quadcopter 工作电源电压: |
| XRA1404IL16-F | 功能描述:接口-I/O扩展器 8 Bit SPI GPIO Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| XRA1404IL16MTR-F | 制造商:Exar Corporation 功能描述:XRA1404IL16MTR-F |
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