参数资料
| 型号： | XRP2997IDBTR-F |
| 厂商： | Exar Corporation |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | IC CONV DDR DDR2 DDR3 8SOIC |
| 特色产品： | XRP2997 Regulator |
| 标准包装： | 1 |
| 应用： | 转换器，DDR，DDR2，DDR3 |
| 输入电压： | 1.1 V ~ 5.5 V |
| 输出数： | 1 |
| 输出电压： | 可调 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 供应商设备封装： | 8-SOIC-EP |
| 包装： | 标准包装 |
| 其它名称： | 1016-1702-6 |
X R P 2 9 9 7
2 A D D R I / I I / I I I B u s T e r m i n a t i o n R e g u l a t o r
APPLICATION INFORMATION
I NPUT C APACITOR CIN
Select the input capacitor CIN for voltage
rating, RMS current rating and capacitance.
The voltage rating should be at least 50%
higher than the regulator’s maximum input
voltage. The value of this capacitor, its charge,
should be selected in order to be able to
supply enough current to the XRP2997 in the
event of a transient increase of source current
required. A minimum value of 10μF is advised
while a recommended value of 47μF is
recommended for optimum transient response
performance.
L AYOUT C ONSIDERATIONS
The XRP2997 is offered in the 8-pin exposed-
pad SOIC package in order to facilitate power
dissipation (heat dissipation). Power
dissipation can be maximized by soldering the
exposed pad to a large land area on top layer
of PCB and by using vias to connect the
exposed pad to an interlayer(s) or bottom
layer. All capacitors should be placed as close
as possible to the respective pins.
PACKAGE SPECIFICATION
8-P IN SOIC E XPOSED P AD
Unit: mm (inch)
Eject hole, oriented hole and mold mark are optional.
? 2012 Exar Corporation
7/8
Rev. 1.2.0
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