参数资料
型号: XRP7603EDB-F
厂商: Exar Corporation
文件页数: 11/13页
文件大小: 0K
描述: IC LED DRVR HIGH PWR 8HSOICN-EP
标准包装: 46
恒定电流:
拓扑: PWM,降压(降压)
输出数: 1
内部驱动器:
类型 - 主要: 通用
类型 - 次要: 白色 LED
频率: 960kHz ~ 1.55MHz
电源电压: 4.5 V ~ 29 V
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm Width)裸露焊盘
供应商设备封装: 8-SOIC
包装: 管件
其它名称: 1016-1338-5
X R P 7 6 0 3
5 0 0 m A 2 9 V N o n - S y n c . B u c k H i g h P o w e r L E D D r i v e r
DESIGN EXAMPLE
Schottky current rating I F
Design a drive circuit for four series connected
LED operating at 0.35A and 24V input voltage.
Nominal LED voltage is 3.3V.
I F ≥ 1 ?
( 4 × 3 . 3 ) × 0 . 35 A = 0 . 235 A
24 V
Resistor RFB calculation
Voltage rating should be 30V or higher. B340A
rated at 30V/3A or equivalent can be used for
RFB =
0 . 2 V
0 . 35 A
= 0 . 57 Ω
its ample current rating and low forward
voltage.
L 1 = ( 4 × 3 . 3 V ) × ( 24 V ? ( 4 × 3 . 3 V ) ) = 47 . 1 μ H
Rs =
= 6 . 4 k Ω
A standard value of 0.56ohm 0805 is selected.
Inductor L1 calculation
24 V × 1 . 2 MHz × ( 0 . 3 × 0 . 35 A )
Use a 47uH standard inductor.
Rs calculation
0.3 V ? (1.5 × 1.15 × 0.525 A × 0.095 Ω )
33 μ A
Use maximum recommended standard resistor
value for Rs of 4k ? .
Input capacitor
A 2.2μF C IN (C1) is needed (refer to table 1).
From Equ.4, the ripple current rating of C IN is
a fraction of 0.35A. A 2.2uF/50V ceramic
capacitor easily meets this requirement and
offers low ESR and ESL.
Fig. 17: Circuit for design example
LAYOUT CONSIDERATION
i) Place the bypass capacitors C4 and C5 as
close as possible to the XRP7603 IC. See
figure 5 for details.
ii) Create a pad under the IC that connects the
power pad (pin 9) to the inductor. Duplicate
this pad through the pcb layers if present, and
on the bottom side of the PCB. Use multiple
vias to connect these layers to aid in heat
dissipation. Do not oversize this pad - since
the LX node is subjected to very high dv/dt
voltages, the stray capacitance formed
between these islands and the surrounding
circuitry will tend to couple switching noise
iii) Connect the Schottky diode cathode as
close as possible to the LX node and inductor
input side. Connect the anode to a large
diameter trace or a copper area that connects
the input ground to the output ground.
iv) The output capacitor, if used, should be
placed close to the load. Use short wide
copper regions to connect output capacitors to
load to minimize inductance and resistances.
v) Keep other sensitive circuits and traces
away from the LX node in particular and away
from the power supply completely if possible.
For more detail on the XRP7603 layout see the
XRP7603EVB Evaluation Board Manual
available on our web site. Each layer is shown
in detail as well as a complete bill of materials.
Fig. 18: XRP7603 Eval Board
Component Side Lay
? 2009 Exar Corporation
11/13
Rev. 1.0.0
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