参数资料
| 型号： | XRT75L00IV-F |
| 厂商： | Exar Corporation |
| 文件页数： | 21/50页 |
| 文件大小： | 0K |
| 描述： | IC LIU E3/DS3/STS-1 SGL 52TQFP |
| 标准包装： | 96 |
| 类型： | 线路接口装置（LIU） |
| 驱动器/接收器数： | 1/1 |
| 规程： | DS3，E3，STS-1 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 52-LQFP |
| 供应商设备封装： | 52-TQFP（10x10） |
| 包装： | 托盘 |
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XRT75L00
E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR
REV. 1.0.2
26
4.3
TRANSMIT PULSE SHAPER:
The Transmit Pulse Shaper converts the B3ZS encoded digital pulses into a single analog Alternate Mark
Inversion (AMI) pulse that meet the industry standard mask template requirements for STS-1 and DS3. See
Figure 8 and Figure 9.
For E3 mode, the pulse shaper converts the HDB3 encoded pulses into a single full amplitude square shaped
pulse with very little slope. This is illustrated in Figure 7.
The Pulse Shaper Block also consists of a Transmit Build Out Circuit, which can either be disabled or enabled
by setting the TxLEV input pin “High” or “Low” (in Hardware Mode) or setting the TxLEV bit to “1” or “0” in the
control register (in Host Mode).
For DS3/STS-1 rates, the Transmit Build Out Circuit is used to shape the transmit waveform that ensures that
transmit pulse template requirements are met at the Cross-Connect system. The distance between the
transmitter output and the Cross-Connect system can be between 0 to 450 feet.
For E3 rate, since the output pulse template is measured at the secondary of the transformer and since there is
no Cross-Connect system pulse template requirements, the Transmit Build Out Circuit is always disabled.
4.3.1
Guidelines for using Transmit Build Out Circuit:
If the distance between the transmitter and the DSX3 or STSX-1, Cross-Connect system, is less than 225 feet,
enable the Transmit Build Out Circuit by setting the TxLEV input pin “Low” (in Hardware Mode) or setting the
TxLEV control bit to “0” (in Host Mode).
If the distance between the transmitter and the DSX3 or STSX-1 is greater than 225 feet, disable the Transmit
Build Out Circuit.
4.3.2
Interfacing to the line:
The differential line driver increases the transmit waveform to appropriate level and drives into the 75
load as
shown in Figure 6.
4.4
Transmit Drive Monitor:
This feature is used for monitoring the transmit line for occurrence of fault conditions such as short circuit on
the line or defective line driver.The device can also be configured for internal tranmit driver monitoring.
To monitor the transmitter output of another chip, connect MTIP pin to the TTIP line via a 270
resistor and
MRing pins to TRing line via 270
resistor as shown in Figure 16
相关PDF资料 |
PDF描述 |
|---|---|
| XRT75L02DIV-F | IC LIU E3/DS3/STS-1 2CH 100TQFP |
| XRT75L03DIV-F | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| XRT75L03IV-F | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| XRT75L04DIV-F | IC LIU E3/DS3/STS-1 4CH 176TQFP |
| XRT75L04IV-F | IC LIU E3/DS3/STS-1 4CH 176LQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XRT75L00IVTR | 功能描述:时钟合成器/抖动清除器 3.3V 1 CH E3/DS3/STS W/JITTER ATTEN RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75L00IVTR-F | 功能描述:时钟合成器/抖动清除器 3.3V 1 CH E3/DS3/STS W/JITTER ATTEN RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75L02 | 制造商:EXAR 制造商全称:EXAR 功能描述:TWO CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER |
| XRT75L02DES | 功能描述:时钟合成器/抖动清除器 2CH T3/E3/STS1 LIU+DESYNCH 3.3V RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75L02DIV-F | 功能描述:网络控制器与处理器 IC 2-Ch E3/DS3/STS-1 RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
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