YEV09T10 10A DC-DC POL Converter
4.5V to 13.8V Input 0.59V to 5.1V Output
Data Sheet
ZD-02092 Rev 1.2, 18-Jun-10
www.power-one.com
Page 1 of 12
Member of the
Family
Applications
Low voltage, high density systems with
Intermediate Bus Architectures (IBA)
Point-of-load regulators for high performance
DSP, FPGA, ASIC, and microprocessors
Desktops, servers, and portable computing
Broadband, networking, optical, and
communications systems
Benefits
One part that covers many applications
Reduces board space, system cost and
complexity, and time to market
Features
RoHS lead free and lead-solder-exempt products are
available
Wide operating temperature range: 0 to 70 C;
optional to a range of -40 to 85 C
High efficiency synchronous buck topology
Low noise fixed frequency operation
Wide input voltage range: 4.5V–13.8V
High continuous output current: 10A
Programmable output voltage range: 0.59V–5.1V
Overcurrent, and output overvoltage protections with
automatic restart
Enable input
Start up into prebiased load
No minimum load requirements
High MTBF of 67 million hours
Industry standard size through-hole single-in-line
package and pinout
0.41”x0.40” (10.4mm x 10.16mm)
Low height of 0.65” (16.51mm)
UL94 V-0 flammability rating
UL60950, CSA C22.2 No. 60950-00, and TUV
EN60950-1:2001
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate
Bus Architecture (IBA). The YEV09T10, non-isolated DC-DC point of load (POL) converter, delivers up to 10A of
output current in an industry-standard single-in-line (SIP) through-hole package. The YEV09T10 POL converter is
an ideal choice for Intermediate Bus Architectures where point of load conversion is a requirement.
Operating from a 4.5-13.8V input the POL converter provides an extremely tightly regulated programmable output
voltage of 0.59V to 5.1V. The POL converter offers exceptional thermal performance, even in high temperature
environments with minimal airflow. This performance is accomplished through the use of advanced circuit
solutions, packaging and processing techniques. The resulting design possesses ultra-high efficiency, excellent
thermal management, and a slim body profile that minimizes impedance to system airflow, thus enhancing cooling
for both upstream and downstream devices. The use of automation for assembly, coupled with advanced power
electronics and thermal design, results in a product with extremely high reliability.