Data Sheet
ZD-01978 REV 3.1
www.power-one.com
Page 1 of 24
YM05S05 DC-DC Converter
3.0-5.5 VDC Input; 0.7525-3.63 VDC Programmable @ 5 A
Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
Benefits
High efficiency – no heat sink required
Reduces total solution board area
Tape and reel packing
Compatible with pick & place equipment
Minimizes part numbers in inventory
The
Products: Y-Series
Features
RoHS lead free and lead-solder-exempted products
are available
Delivers up to 5 A
No derating up to 85 °C
Surface-Mount package
Industry-standard footprint and pinout
Small size and low profile:
o
0.80” x 0.45” x 0.247”
o
20.32 mm x 11.43 mm x 6.27 mm
Weight: 0.08 oz [2.22 g]
Coplanarity less than 0.003”, maximum
Synchronous Buck Converter topology
Start up into pre-biased output
No minimum load required
Programmable output voltage via external resistor
Operating ambient temperature: -40 °C to 85 °C
Remote ON/OFF
Fixed frequency operation
Auto-reset output over-current protection
Auto-reset over-temperature protection
High reliability, MTBF approx. 69 Million Hours
calculated per Telcordia TR-332, Method I Case 1
All materials meet UL94, V-0 flammability rating
UL60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN60950
Description
The YM05S05 non-isolated dc-dc converters deliver up to 5 A of output current in an industry-standard surface-
mount package. Operating from a 3.0 – 5.5 V input, these converters are ideal choices for Intermediate Bus
Architectures where Point-of-Load (POL) power delivery is generally a requirement. They provide an extremely
tight regulated programmable output voltage from 0.7525 V to 3.63 V.
The Y-Series of converters provides exceptional thermal performance, even in high temperature environments
with minimal airflow. No derating is required up to 85
°C, even without airflow at natural convection. This
performance is accomplished through the use of advanced circuitry, packaging and processing techniques to
achieve a design possessing ultra-high efficiency, excellent thermal management and a very low-body profile.
The low-body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.