MAR 23, 2007 revised to APR 16, 2007
Page 1 of 26
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YNL12S100xy DC-DC Converter Family Data Sheet
9.6-14 VDC Input; 1.0-5.0 VDC Output @ 10A
Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Servers, workstations
Distributed Power Architectures
Benefits
High efficiency – no heat sink required
Reduces total solution board area
Tape and reel packing
Compatible with pick & place equipment
The
Products: Y-Series
Features
RoHS lead-free solder and lead-solder-exempted
products are available
Delivers up to 10 A (50 W)
No derating up to 85 °C (70 °C for 5 V output)
Surface-mount package
Industry-standard footprint and pinout
Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98mm)
Weight: 0.22 oz [6.12 g]
Start-up into pre-biased output
No minimum load required
Output voltage trim +/-10%
Operating ambient temperature: -40 °C to 85 °C
Remote output sense
Remote ON/OFF (Positive or Negative)
Fixed-frequency operation
Auto-reset output overcurrent protection
Auto-reset overtemperature protection
High reliability, MTBF = TBD Million Hours
All materials meet UL94, V-0 flammability rating
UL 60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN 60950
Description
The YNL12S100xy non-isolated DC-DC converters deliver up to 10 A of output current in an industry-
standard surface-mount package. The YNL12S100xy converters operate from a 9.6 – 14 VDC input. These
converters are ideal choices for Intermediate Bus Architectures where point-of-load power delivery is
generally a requirement.
Within the YNL12S100xy family, converters come in individual output voltage versions, allowing coverage of
the output voltage range from 1.0 to 5.0 V. Each version is capable of providing an extremely tight, highly
regulated, and trimmable output.
The YNL12S100xy converters provide exceptional thermal performance, even in high temperature
environments with minimal airflow. No derating is required up to 85
oC (up to 70 oC for 5 V output). This is
accomplished through the use of circuitry, packaging, and processing techniques to achieve ultra-high
efficiency, excellent thermal management, and a very low body profile.
The low body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.