参数资料
型号: YNM05S05
厂商: POWER-ONE INC
元件分类: 电源模块
英文描述: 1-OUTPUT DC-DC REG PWR SUPPLY MODULE
文件页数: 23/25页
文件大小: 335K
代理商: YNM05S05
MCD10190 Rev. 1.0, 21-Jun-10
Page 7 of 25
www.power-one.com
YNM05S05 DC-DC Converter Data Sheet
3.0-5.5 VDC Input; 0.7525-3.63 VDC Programmable @ 5 A
Overtemperature Protection (OTP)
The
converter
will
shut
down
under
an
overtemperature condition to protect itself from
overheating caused by operation outside the thermal
derating curves, or operation in abnormal conditions
such as system fan failure. After the converter has
cooled to a safe operating temperature, it will
automatically restart.
Safety Requirements
The
converter
meets
North
American
and
International safety regulatory requirements per
UL60950 and EN60950. The maximum DC voltage
between any two pins is Vin under all operating
conditions. Therefore, the unit has ELV (extra low
voltage) output; it meets SELV requirements under
the condition that all input voltages are ELV.
The converter is not internally fused. To comply with
safety agencies’ requirements, a recognized fuse
with a maximum rating of 15 Amps must be used in
series with the input line.
Characterization
General Information
The converter has been characterized for many
operational aspects, to include thermal derating
(maximum load current as a function of ambient
temperature and airflow) for vertical and horizontal
mounting,
efficiency,
startup
and
shutdown
parameters, output ripple and noise, transient
response to load step-change, overload, and short
circuit.
The figures are numbered as Fig. x.y, where x
indicates the different output voltages, and y
associates with specific plots (y = 1 for the vertical
thermal derating, …). For example, Fig. x.1 will refer
to the vertical thermal derating for all the output
voltages in general.
The following pages contain specific plots or
waveforms associated with the converter. Additional
comments for specific data are provided below.
Test Conditions
All data presented were taken with the converter
soldered to a test board, specifically a 0.060” thick
printed wiring board (PWB) with four layers. The top
and bottom layers were not metalized. The two inner
layers, comprised of two-ounce copper, were used to
provide traces for connectivity to the converter.
The lack of metalization on the outer layers as well
as the limited thermal connection ensured that heat
transfer from the converter to the PWB was
minimized. This provides a worst-case but consistent
scenario for thermal derating purposes.
All measurements requiring airflow were made in the
vertical and horizontal wind tunnels using Infrared
(IR)
thermography
and
thermocouples
for
thermometry.
Ensuring components on the converter do not
exceed their ratings is important to maintaining high
reliability. If one anticipates operating the converter
at or close to the maximum loads specified in the
derating curves, it is prudent to check actual
operating
temperatures
in
the
application.
Thermographic
imaging
is
preferable;
if
this
capability is not available, then thermocouples may
be used. The use of AWG #40 gauge thermocouples
is recommended to ensure measurement accuracy.
Careful routing of the thermocouple leads will further
minimize measurement error. Refer to Fig. E for
optimum measuring thermocouple location.
Fig. E: Location of the thermocouple for thermal testing.
Thermal Derating
Load current vs. ambient temperature and airflow
rates are given in Figs. x.1 to x.2 for maximum
temperature of 120 °C. Ambient temperature was
varied between 25 °C and 85 °C, with airflow rates
from 30 to 500 LFM (0.15 m/s to 2.5 m/s), and
vertical and horizontal converter mounting.
For each set of conditions, the maximum load
current is defined as the lowest of:
(i) The output current at which any MOSFET
temperature does not exceed a maximum specified
temperature of 120 °C as indicated by the
thermographic image, or
(ii) The maximum current rating of the converter
(5 A).
During normal operation, derating curves with
maximum FET temperature less than or equal to
120 °C should not be exceeded. Temperature on the
PCB at the thermocouple location shown in Fig. E
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