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参数资料
| 型号： | ZICM357P2-1C |
| 厂商： | CEL |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | MOD EM357 ZIG 802.15.4 U.FL CONN |
| 标准包装： | 28 |
| 系列： | MeshConnect™ |
| 频率： | 2.405GHz ~ 2.48GHZ |
| 数据传输率 - 最大： | 250kbps |
| 调制或协议： | 802.15.4 Zigbee |
| 应用： | 住宅/楼宇自动化，保安，ZigBee? |
| 功率 - 输出： | 20dBm |
| 灵敏度： | -100dBm |
| 电源电压： | 2.7 V ~ 3.6 V |
| 电流 - 接收： | 28mA |
| 电流 - 传输： | 170mA |
| 数据接口： | PCB，表面贴装 |
| 存储容量： | 192kB 闪存，12kB RAM |
| 天线连接器： | U.FL |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 模块 |
| 包装： | 散装 |
| 其它名称： | ZICM357P2-1C-B ZICM357P2-1C-B-ND |
MeshConnect? EM357 Module
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp Up Rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
TLiquidus
Time above TL
Tpeak
Time within 5o of Tpeak
Time from 25o to Tpeak
Ramp Down Rate
3o/sec max
150oC
200oC
60-120 sec
217oC
60-150 sec
250oC
20-30 sec
8 min max
6oC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet
the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated
Terminations Section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be
easily removed with any cleaning process.
? Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering flux residuals and encapsulated water could lead to
short circuits between neighboring pads. Water could also damage any stickers or labels.
? Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any
stickers or labels.
? Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
? Proper alignment and centering of the module over the pads
? Proper solder joints on all pads
? Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Page 12
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ZICM357P2-1C-B | 功能描述:Zigbee/802.15.4模块 MeshConnect Module 2405-2480MHz RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZICM357P2-1C-NF | 功能描述:Zigbee/802.15.4模块 RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZICM357P2-1-NF | 功能描述:Zigbee/802.15.4模块 RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZICM357P2-1-NF-B | 功能描述:Zigbee/802.15.4模块 Meshconnect Module 2405-2480MHz RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZICM357P2-2 | 功能描述:Zigbee/802.15.4模块 MeshConnect Module 2405-2480MHz RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
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