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参数资料
| 型号： | ZMXM-400-KIT-2 |
| 厂商： | CEL |
| 文件页数： | 12/14页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL MATRIX MODULE |
| 产品培训模块： | MeshConnect Wireless Lighting Control |
| 特色产品： | 10mW ZigBee Radio Modules |
| 标准包装： | 1 |
| 系列： | Matrix |
| 类型： | 收发器，802.15.4/Zigbee |
| 频率： | 2.4GHz |
| 适用于相关产品： | CC2430 |
| 已供物品： | 4 个模块，电池，线缆，CD |
| 其它名称： | 101-MTX10-KIT1 101-MTX10-KIT1-ND ZMXM-400-KIT-1 ZMXM-400-KIT-1-ND ZMXM-KIT-1 ZMXM-KIT-1-ND |
ZMXM-400 Series
PROCESSING (Continued)
Cooling Phase
A controlled cooling phase avoids unwanted metallurgical effects of the solder, and possible mechanical tensions in the
products. Controlled cooling helps achieve the brightest possible solder fillets with a good shape and low contact angle.
? Temperature fall rate: max 3oC/sec
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
The pastes listed in the examples below meet these criteria.
Soldering Paste: Indium 5.1 (Indium Corporation of America)
Alloy Specification: SAC305 - Sn Zinc 96.5%/Ag Silver 3.0%/Cu Copper 0.5%
Alloy Specification: SAC387 - Sn Zinc 95.5%/Ag Silver 3.8%/Cu Copper 0.7%
Melting Temperature: 217oC
Soldering Paste: LFSOLDER TLF-206-93F (Tamura Kaken [UK] Ltd.)
Alloy Specification: Sn Zinc 95.5%/Ag Silver 3.9%/Cu Copper 0.6%
Melting Temperature: 216-221oC
The final choice of the soldering paste depends on individual factory approved manufacturing procedures.
Stencil Thickness: 150 μm for host boards
Note:
The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet
the appropriate IPC specification. See IPC-A-610-12.2.4.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
?
?
?
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post soldering cleaning step.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ZMXM-401-1 | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module PCB Trace Antenna RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-401-1-B | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module PCB Trace Antenna RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-401-1C | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module MMCX Connector RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-401-1C-B | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module MMCX Connector RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-401-KIT-1 | 制造商:California Eastern Laboratories (CEL) 功能描述:KIT EVAL MATRIX MODULE |
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