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| 型号： | ZXMP6A17KTC |
| 厂商： | Diodes Inc |
| 文件页数： | 2/8页 |
| 文件大小： | 0K |
| 描述： | MOSFET P-CH 60V 4.4A DPAK |
| 标准包装： | 1 |
| FET 型： | MOSFET P 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 60V |
| 电流 - 连续漏极(Id) @ 25° C： | 4.4A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 125 毫欧 @ 2.3A，10V |
| Id 时的 Vgs(th)（最大）： | 1V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 17.7nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 637pF @ 30V |
| 功率 - 最大： | 2.11W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-252-3，DPak（2 引线+接片），SC-63 |
| 供应商设备封装： | TO-252-3 |
| 包装： | 标准包装 |
| 产品目录页面： | 1578 (CN2011-ZH PDF) |
| 其它名称： | ZXMP6A17KTCDIDKR |
A Product Line of
Diodes Incorporated
ZXMP6A17K
Maximum Ratings
@T A = 25°C unless otherwise specified
Drain-Source voltage
Gate-Source voltage
Characteristic
(Note 3)
Symbol
V DSS
V GS
Value
-60
± 20
6.6
Unit
V
V
Continuous Drain current
V GS = 10V
T A =70 ° C (Note 3)
I D
5.3
A
(Note 2)
4.4
Pulsed Drain current
V GS = 10V
(Note 4)
I DM
20.3
A
Continuous Source current (Body diode)
Pulsed Source current (Body diode)
(Note 3)
(Note 4)
I S
I SM
9.3
20.3
A
A
Thermal Characteristics @T A = 25°C unless otherwise specified
Characteristic
(Note 2)
Symbol
Value
4.17
33.3
Unit
Power dissipation
Linear derating factor
(Note 3)
P D
9.25
74.0
W
mW/ ° C
(Note 5)
(Note 2)
2.11
16.8
30.0
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and storage temperature range
(Note 3)
(Note 5)
(Note 6)
R θ JA
R θ JL
T J , T STG
13.5
59.1
2.41
-55 to 150
° C/W
° C
Notes:
2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note 2, except the device is measured at t ≤ 10 sec.
4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 μs. The pulse current is limited by the maximum junction temperature.
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Thermal resistance from junction to solder-point (at the end of the drain lead).
ZXMP6A17K
Document Revision: 2
2 of 8
www.diodes.com
July 2009
? Diodes Incorporated
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