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参数资料
| 型号： | 04023J2R9ABSTR |
| 厂商： | AVX Corporation |
| 文件页数： | 24/26页 |
| 文件大小： | 0K |
| 描述： | CAP THIN FILM 2.9PF 25V 0402 |
| 标准包装： | 1 |
| 系列： | Accu-P® |
| 电容： | 2.9pF |
| 电压 - 额定： | 25V |
| 容差： | ±0.05pF |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0402（1005 公制） |
| 工作温度： | -55°C ~ 125°C |
| 特点： | RF，高 Q 值，低损耗 |
| 包装： | 剪切带 (CT) |
| 尺寸/尺寸： | 0.039" L x 0.022" W（1.00mm x 0.55mm） |
| 高度 - 座高（最大）： | 0.020"（0.50mm） |
| 其它名称： | 478-6775-1 |
Accu-P ?
Application Notes
Accu-P SMD capacitors are designed for soldering to printed
1
GENERAL
?
circuit boards or other substrates. The construction of the
components is such that they will withstand the time/temper-
ature profiles used in both wave and reflow soldering methods.
CIRCUIT BOARD TYPE
The circuit board types which may be used with Accu-P ? are
as follows:
All flexible types of circuit boards
(eg. FR-4, G-10) and also alumina.
For other circuit board materials, please consult factory.
HANDLING
SMD capacitors should be handled with care to avoid damage
or contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly recom-
mended for individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized. For
automatic equipment, taped and reeled product gives the
ideal medium for direct presentation to the placement
machine.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good
joints and minimize component movement during reflow
soldering. Pad designs are given below for both wave and
reflow soldering.
The basis of these designs is:
a. Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but
it is not advisable to go below this.
b. Pad overlap 0.5mm beneath large components. Pad
overlap about 0.3mm beneath small components.
c. Pad extension of 0.5mm for reflow of large components
and pad extension about 0.3mm for reflow of small com-
ponents. Pad extension about 1.0mm for wave soldering.
REFLOW SOLDERING
PAD DIMENSIONS: millimeters (inches)
01005
Accu-P ?
0201
Accu-P ?
0402
Accu-P ?
0603
Accu-P ?
0805
Accu-P ?
1210
Accu-P ?
0.17
(0.007)
0.22
(0.009)
0.20
(0.008)
0.26
(-0.010)
0.78 0.26
(0.030) (-0.010)
0.26
(-0.010)
0.34
(0.013)
1.7
(0.068)
0.6
(0.024)
0.5
(0.020)
2.3
(0.091)
0.85
(0.033)
0.6
(0.024)
1.0
(0.039)
1.0
(0.039)
0.6
(0.024)
0.85
(0.033)
3.0
(0.118)
1.0
(0.039)
0.55
(0.022)
0.8 (0.031)
4.0
(0.157)
2.0
(0.079)
1.0
(0.039)
1.25 (0.049)
1.0
(0.039)
2.5 (0.098)
28
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 04023J2R9ABSTR/5K | 制造商:AVX Corporation 功能描述:CAP THIN FILM 2.9PF 25V 0402 |
| 04023J2R9BBSTR | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 25volts 2.9pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 04023J2R9BBSTR/500 | 制造商:AVX Corporation 功能描述:CAP THIN FILM 2.9PF 25V 0402 |
| 04023J2R9BBSTR\\500 | 制造商:AVX Corporation 功能描述:CAP 2.9PF 25VDC C0G 0.1PF SMD 0402 - Tape and Reel |
| 04023J2R9BBSTR\500 | 功能描述:薄膜电容器 25volts 2.9pF RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
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