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参数资料
| 型号： | 04023J2R9ABSTR |
| 厂商： | AVX Corporation |
| 文件页数： | 25/26页 |
| 文件大小： | 0K |
| 描述： | CAP THIN FILM 2.9PF 25V 0402 |
| 标准包装： | 1 |
| 系列： | Accu-P® |
| 电容： | 2.9pF |
| 电压 - 额定： | 25V |
| 容差： | ±0.05pF |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0402（1005 公制） |
| 工作温度： | -55°C ~ 125°C |
| 特点： | RF，高 Q 值，低损耗 |
| 包装： | 剪切带 (CT) |
| 尺寸/尺寸： | 0.039" L x 0.022" W（1.00mm x 0.55mm） |
| 高度 - 座高（最大）： | 0.020"（0.50mm） |
| 其它名称： | 478-6775-1 |
Accu-P ?
Application Notes
PREHEAT & SOLDERING
The rate of preheat in production should not exceed 4°C/
second and a recommended maximum is about 2°C/second.
Temperature differential from preheat to soldering should not
exceed 100°C.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are
thoroughly cleaned of flux residues, especially the space
beneath the device. Such residues may otherwise become
conductive and effectively offer a lossy bypass to the device.
For further specific application or process advice, please consult
AVX.
COOLING
After soldering, the assembly should preferably be allowed
to cool naturally. In the event of assisted cooling, similar
conditions to those recommended for preheating should be
used.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 150°C is
required. The most preferable technique is to use hot air sol-
dering tools. Where a soldering iron is used, a temperature
controlled model not exceeding 30 watts should be used and
set to not more than 260°C.
RECOMMENDED REFLOW
SOLDERING PROFILE
COMPONENTS WITH
SnPb TERMINATIONS
Various recommended cleaning conditions (which must be
optimized for the flux system being used) are as follows:
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,
water and other standard PCB
cleaning liquids.
Ultrasonic conditions . . power-20w/liter max.
frequency-20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
Time . . . . . . . . . . . . . . . 5 minutes max.
STORAGE CONDITIONS
Recommended storage conditions for Accu-P ? prior to use
are as follows:
Temperature . . . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . . 860mbar to 1060mbar
RECOMMENDED REFLOW
SOLDERING PROFILE
LEAD FREE
COMPONENTS WITH
Sn100 TERMINATIONS
1
220
210
200
190
Assembly exits heat–
no forced cooldown
330
260
250
Peak Temperature = 260oC
180
170
160
150
Assembly enters the
preheat zone
Additional soak time
to allow uniform
heating of the
substrate
45-60 sec.
above solder
melting point
186 ° C solder melting
temperature
200
140
130
120
110
100
90
150
100
80
70
60
Soak time
1) Activates the flux
2) Allows center of board
temperatures to catch up with
corners
50
50
40
0
0:00
0:43
1:28
2:10
2:53
3:36
4:19
5:02
5:48
6:29
30
20
Time
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (mins)
29
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 04023J2R9ABSTR/5K | 制造商:AVX Corporation 功能描述:CAP THIN FILM 2.9PF 25V 0402 |
| 04023J2R9BBSTR | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 25volts 2.9pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 04023J2R9BBSTR/500 | 制造商:AVX Corporation 功能描述:CAP THIN FILM 2.9PF 25V 0402 |
| 04023J2R9BBSTR\\500 | 制造商:AVX Corporation 功能描述:CAP 2.9PF 25VDC C0G 0.1PF SMD 0402 - Tape and Reel |
| 04023J2R9BBSTR\500 | 功能描述:薄膜电容器 25volts 2.9pF RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
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