参数资料
| 型号： | 101-0488 |
| 厂商： | Rabbit Semiconductor |
| 文件页数： | 17/90页 |
| 文件大小： | 0K |
| 描述： | MODULE RABBITCORE RCM2210 |
| 标准包装： | 1 |
| 系列： | RabbitCore® |
| 模块/板类型： | 单板计算机模块 |
| 适用于相关产品： | RCM2210 |
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18
RabbitCore RCM2200
tion of how Dynamic C handles multitasking with costatements and cofunctions, see
Chapter 5, “Multitasking with Dynamic C,” and Chapter 6, “The Virtual Driver,” in the
Dynamic C User’s Manual.
3.1.4.3 TOGGLELED.C
One of Dynamic C’s unique and powerful aspects is its ability to efficiently multitask
using cofunctions and costatements. This simple application demonstrates how these pro-
gram elements work.
This sample program uses two costatements to set up and manage the two tasks. Costate-
ments must be contained in a loop that will “tap” each of them at regular intervals. This
program:
1. Initializes the pins of Port A as outputs.
2. Sets all the pins of Port A high, turning off the attached LEDs.
3. Sets the toggled LED status variable vswitch to 0 (LED off).
4. Starts an endless loop using a while(1) expression, and within that loop:
Executes a costatement that flashes LED DS3;
Executes a costatement that checks the state of switch S2 and toggles the state of
vswitch
if it is pressed;
Turns LED DS2 on or off, according to the state of vswitch.
These steps repeat as long as the program is allowed to run.
The first costatement is a compressed version of FLASHLED.c, with slightly different
flash timing. It also uses the library function DelayMs() to deliver more accurate timing
than the simple delay loops of the previous program.
The second costatement does more than check the status of S2. Switch contacts often
“bounce” open and closed several times when the switch is actuated, and each bounce can
be interpreted by fast digital logic as an independent press. To clean up this input, the code
in the second costatement “debounces” the switch signal by waiting 50 milliseconds and
checking the state of the switch again. If it is detected as being closed both times, the pro-
gram considers it a valid switch press and toggles vswitch.
Unlike most C statements, the two costatements are not executed in their entirety on each
iteration of the while(1) loop. Instead, the list of statements within each costatement is
initiated on the first loop, and then executed one “slice” at a time on each successive inter-
ation. This mode of operation is known as a state machine, a powerful concept that per-
mits a single processor to efficiently handle a number of independent tasks.
The ability of Dynamic C to manage state machine programs enables you to create very
powerful and efficient embedded systems with much greater ease than other programming
methods.
More Information
See the entries for the DelayMs() function, as well as Section 5, “Multitasking with
Dynamic C,” in the Dynamic C User’s Manual.
相关PDF资料 |
PDF描述 |
|---|---|
| AT45DB321B-TC | IC FLASH 32MBIT 20MHZ 32TSOP |
| AT45DB011B-SC | IC FLASH 1MBIT 20MHZ 8SOIC |
| SOMOMAP3530-11-1670EFCR | SYSTEM ON MODULE LV OMAP3530 |
| 395-030-523-202 | CARD EDGE 30POS DL .100X.200 BLK |
| 395-030-523-201 | CARD EDGE 30POS DL .100X.200 BLK |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 101-0492 | 功能描述:单板计算机 OP6800 RoHS:否 制造商:Ampro By ADLINK 外观尺寸:EPIC 处理器类型:Intel Atom D510 频率:1.66 GHz 存储容量:2 GB (max) 存储类型:DDR2, L2 Cache 接口类型:Ethernet, PS/2, SATA, Serial, USB 工作电源电压:5 V, 12 V 功耗:13 W 最大工作温度:+ 70 C 尺寸:165.1 mm x 114.3 mm |
| 101-0494 | 功能描述:模块化系统 - SOM RCM2250 RABBITCORE RoHS:否 制造商:Digi International 外观尺寸:ConnectCore 9P 处理器类型:ARM926EJ-S 频率:150 MHz 存储容量:8 MB, 16 MB 存储类型:NOR Flash, SDRAM 接口类型:I2C, SPI, UART 工作电源电压:3.3 V 最大工作温度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in |
| 101-0495 | 功能描述:处理器配件 Baseplate RoHS:否 制造商:Olimex Ltd. 产品:Cable 用于: |
| 101-0497 | 功能描述:单板计算机 OP6810 RoHS:否 制造商:Ampro By ADLINK 外观尺寸:EPIC 处理器类型:Intel Atom D510 频率:1.66 GHz 存储容量:2 GB (max) 存储类型:DDR2, L2 Cache 接口类型:Ethernet, PS/2, SATA, Serial, USB 工作电源电压:5 V, 12 V 功耗:13 W 最大工作温度:+ 70 C 尺寸:165.1 mm x 114.3 mm |
| 10104997-00C-10B | 功能描述:高速/模块连接器 XCEDE 2W 6PVH 6COL RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
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