参数资料
| 型号： | 10113949-M0E-20DLF |
| 厂商： | FCI |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER 2PR 8COL VERT |
| 标准包装： | 256 |
| 系列： | ECede® |
| 连接器用途： | 背板 |
| 连接器类型： | 接头，公引脚和刀片 |
| 连接器类型： | XCede?，右端壁 |
| 加载位置的数目： | 全部 |
| 列数： | 8 |
| 安装类型： | 通孔 |
| 端子： | 压配式 |
| 触点布局，典型： | 16 信号对，20 接地 |
| 触点表面涂层： | 金或金，GXT? |
| 触点涂层厚度： | 30µin（0.76µm） |
| 包装： | 托盘 |
| 材料可燃性额定值： | UL94 V-0 |
| 其它名称： | 609-4364 |
BAcKpAneL connectors
XCede ? HigH-PerformanCe
BaCkPlane ConneCtor SyStem
Description
Fci’s Xcede ? connector platform is designed for 25 Gb/s
performance to provide the headroom to support future
high-speed, serial data rate requirements demanded by
next-generation equipment in data centers and service
provider networks. the use of engineering polymers in a
resonance-damping shield enables very low crosstalk
across a wide frequency range.
Xcede connectors also address requirements for higher
linear signal density at the interface of backplane and
daughter card. signal connectors can be configured with
2, 4 or 6 differential pairs per column, providing up to 82.4
differential pairs/inch, suiting architectures with multiple
front or rear fabric slots and blade systems with cooling
straight through the backplane. complementary guidance
and power modules are also included in the product
range. A wafer organizer can be used to combine groups
of right-angle signal, guidance and power modules as an
integrated daughter-card connector.
the Xcede backplane header system provides the
ruggedness and long-term reliability required by today’s
systems. the wide ground contacts feature a stiffness-
enhancing rib and are advanced well ahead of the signals
for exceptional robustness and signal pin protection.
FeAtures & BeneFits
High-speed backplane system designed for 25 Gb/s
Use of engineering materials in the shield aids in
reduction of crosstalk resonances
1.85 mm column pitch offers high linear signal density
? Configurations with 6 differential pairs/column fit 36 mm
card slot pitch and provide 82.4 pairs/inch
? 4 pairs/column fit 25 mm slot pitch with 54.9 pairs/inch
? 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch
Two ground vias between differential pairs allow elongated
antipads to further improve impedance
Optional short compliant pin permits deeper backdrilling and
dual diameter vias to enhance return loss performance
Wide ground contacts feature a stiffening rib and are
advanced well ahead of signals for exceptional robustness
and signal pin protection
Intermateable, electrically and mechanically interchangeable
licensed second source to Amphenol TCS
Xcede? is a registered trademark of Amphenol corporation
tArGet MArKets / AppLicAtions
Communications
? Routers
? Switches
? Networking
? Access
? Transport
? Wireless
Data
? Servers
? Storage Systems
Industrial
Medical
Test & Measurement
相关PDF资料 |
PDF描述 |
|---|---|
| 1.5KE200CHE3/73 | TVS BIDIR 1.5KW 200V 10% 1.5KE |
| M20-6152005 | CONN HDR FMALE .100" 40POS AU |
| 1.5KE200C-E3/73 | TVS BIDIR 1.5KW 200V 10% 1.5KE |
| CRCW06032R49FKEA | RES 2.49 OHM 1/10W 1% 0603 SMD |
| 1.5KE180C-E3/73 | TVS BIDIR 1.5KW 180V 10% 1.5KE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 10113949-M0E-30B | 功能描述:高速/模块连接器 RT MOD RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 10113949-M0E-30DLF | 功能描述:高速/模块连接器 RT MOD RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 10113949-M0E-40B | 功能描述:高速/模块连接器 RT MOD RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 10113949-M0E-40DLF | 功能描述:高速/模块连接器 RT MOD RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 10113949-M0E-50B | 功能描述:高速/模块连接器 RT MOD RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
发布紧急采购，3分钟左右您将得到回复。