参数资料
型号: 1N5550D3A-JQRS.L2D
厂商: SEMELAB LTD
元件分类: 参考电压二极管
英文描述: 3 A, 200 V, SILICON, RECTIFIER DIODE
封装: HERMETIC SEALED, CERAMIC, DLCC3 VARIANT A, 2 PIN
文件页数: 1/4页
文件大小: 287K
代理商: 1N5550D3A-JQRS.L2D
POWER RECTIFIER
DIODE
Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab plc
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Document Number 8814
Telephone +44 (0) 1455 556565
Fax +44 (0) 1455 552612
Issue 2
Email: sales@semelab-tt.com
Website: http://www.semelab-tt.com
Page 1 of 4
1N5550D3A / 1N5550D3B
VBR = 220V, IF = 5A, Standard Reverse Recovery Rectifier Diode
Light Weight Hermetic Ceramic Surface Mount Package
Designed as a Drop In Replacement for “D-5B” / “E-MELF”
Package
Switching Power Supply Applications
Space Level and High-Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS (T
A = 25°C unless otherwise stated)
VBR
Breakdown Voltage
220V
VRWM
Working Peak Reverse Voltage
200V
IO
Average Rectified Output Current, TSP = 130°C
5A
IO(1)
Average Rectified Output Current, TA = 55°C
3A
IFSM
Surge Current, tp = 8.3ms
(2)
100A
TJ
Junction Temperature Range
-65 to +175°C
Tstg
Storage Temperature Range
-65 to +175°C
THERMAL PROPERTIES
Symbols
Parameters
Max.
Units
RθJSP(IN)
Thermal Resistance, Junction To Solder Pads TSP = 25°C
17
°C/W
RθJA(PCB)(3)
Thermal Resistance, Junction To Ambient, On PCB
50
°C/W
RθJA(PCB)(4)
Thermal Resistance, Junction To Ambient, On PCB
117
°C/W
Notes
(1) IO1 is rated at 3.0A @ TA = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to RθJA(PCB) ≤ 52°C/W. De-rate linearly 25mA/°C >55°C.
(2) TA = 25°C @ IO=3.0A and VRWM for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”), (1.78mm x 3.94mm) , horizontal in still air.
IO1 is rated at 1.5A @ TA = 55°C for PC boards where RθJA(PCB) ≤ 120°C/W. De-rate at 12.5mA/°C above TA = 55°C in this case.
Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5B device.
相关PDF资料
PDF描述
1N5553 3 A, 800 V, SILICON, RECTIFIER DIODE
1N5821/73-E3 3 A, 30 V, SILICON, RECTIFIER DIODE, DO-201AD
1N5822/73 3 A, 40 V, SILICON, RECTIFIER DIODE, DO-201AD
1N5822/72 3 A, 40 V, SILICON, RECTIFIER DIODE, DO-201AD
1N5822/71 3 A, 40 V, SILICON, RECTIFIER DIODE, DO-201AD
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