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1N6626D3A / 1N6626D3B
High Reliability Screening Options Available
High forward current surge current capability
Switching power supplies or other applications requiring
fast switching and low forward loss
ABSOLUTE MAXIMUM RATINGS (T
A = 25°C unless otherwise stated)
VRWM
Working Peak Reverse Voltage
200V
IO
1
Average Rectified Forward Current TA = 25°C
1.75A
IFSM2
Peak Forward Current Surge
75A
TJ
Junction Temperature Range
-65 to +175°C
Tstg
Storage Temperature Range
-65 to +175°C
TSP
Maximum Soldering Pad Temperature for 20s
260°C
THERMAL PROPERTIES
Symbols
Parameters
Max.
Units
RθJSP(IN)
Thermal Resistance, Junction To Solder Pads TSP = 25°C
40
°C/W
RθJA(PCB)(3)
Thermal Resistance, Junction To Ambient, On PCB
72.5
°C/W
RθJA(PCB)(4)
Thermal Resistance, Junction To Ambient, On PCB
110
°C/W
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to RθJA(PCB) ≤ 85°C/W.
(2) TA = 25°C @ IO=0A and VRWM = 0V for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”), (1.78mm x 3.94mm) , horizontal in still air.
IO1 is rated at 1.5A @ TA = 25°C for PC boards where RθJA(PCB) ≤ 111°C/W. Derate at 10mA/°C above TA = 25°C in this case.
Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.