参数资料
型号: 1SPP-BT-F
厂商: Future Designs Inc
文件页数: 3/72页
文件大小: 0K
描述: KIT DEMO BLUETOOTH
标准包装: 1
类型: 蓝牙
频率: 2.4GHz
适用于相关产品: BGB203
已供物品: 2 个板和 USB 线缆
其它名称: 622-1020
Philips Semiconductors
UM_1SPP
BGB203 BT 2.0 Serial Port Profile Module User’s Guide
1. Introduction
The 1SPP embedded firmware uses the Philips’ BGB203 Bluetooth SIP to provide the
Bluetooth Serial Port Profile (SPP) to embedded application designs. This firmware
exposes a command set that follows the V.25 and GSM conventions to the application
developer that can be accessed through a physical Universal Asynchronous Receive
Transmit (UART) interface. These commands are translated by the 1SPP firmware into
Bluetooth features. More specifically, the Bluetooth protocol stack features that are
included in the 1SPP module are the Bluetooth RF, Baseband/Link Controller (LC), Link
Manager (LM), Logical Link and Adaptation Protocol (L2CAP), Service Discovery
Protocol (SDP), RFCOMM Protocol, Serial Port Profile (SPP), and the Generic Access
Profile (GAP). By including the Bluetooth protocol stack in the firmware and providing an
easy to use command set which applications can call externally (see Figure 1), the host
processor’s requirements are minimized.
In addition to providing the Bluetooth protocol stack functionality listed above, the
firmware also provides several features to further support embedded applications that
use the RS-232 protocol. These features include full support for DTE and DCE devices,
including RTS/CTS flow control, and full support of all modem signals (CD, RI, DTR, and
DSR). The 1SPP firmware is highly configurable and can be configured to support only
the features that are required. For very simple applications, full functionality can be
achieved without using any of the RS-232 signals.
? Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release:21 Dec 2005
Published in The Netherlands
相关PDF资料
PDF描述
2.0 X 3.0 X 0.50 SHIELD RF STD 2 X 3 X .5"
2 INCH-D2-MV-MINI SENSOR 2" H2O D MV DUAL OS
2000310 PRESSURE TRANSDUCER MSP SERIES
2008639-1 LIGHT SCKT 10MM HI INTENST ASSY
2008675-1 STAR BOARD LED HOLDER/HEATSINK
相关代理商/技术参数
参数描述
1SPTG040317 制造商:LG Corporation 功能描述:SCREW,TAPPING[TRUSS HEAD]
1SQ-25-GM110 功能描述:GRIP MATERIAL 1" SQ BLK 25/PK RoHS:是 类别:胶带,粘合剂 >> 带 系列:GM110 标准包装:1 系列:- 胶带类型:标记 - 印有“无铅区域”字样 胶合剂:- 背衬,载体:- 厚度:- 厚度 - 胶合剂:- 厚度 - 背胶,载体,衬垫:- 宽:1.00"(25.40mm) 长度:360'(109.7m)120 码 颜色:白色字符,绿色背景 使用:标记 温度范围:- 包装:卷
1SQ-25-GM400 功能描述:GRIP MATERIAL 1" SQ BLK 25/PK RoHS:是 类别:胶带,粘合剂 >> 带 系列:GM400 标准包装:1 系列:- 胶带类型:标记 - 印有“无铅区域”字样 胶合剂:- 背衬,载体:- 厚度:- 厚度 - 胶合剂:- 厚度 - 背胶,载体,衬垫:- 宽:1.00"(25.40mm) 长度:360'(109.7m)120 码 颜色:白色字符,绿色背景 使用:标记 温度范围:- 包装:卷
1SQ-28-8997 功能描述:POLY TAPE 1"X1" ROLL OF 28 制造商:3m (tc) 系列:* 零件状态:有效 标准包装:1
1SR124-100 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES