参数资料
型号: 2065657-1
厂商: TE Connectivity
文件页数: 4/21页
文件大小: 0K
描述: CONN RCPT 80POS 8ROW RT ANG HM-Z
特色产品: Z-Pack HM-Zd Plus
标准包装: 20
系列: Z-PACK HM-Zd
连接器用途: 背板
连接器类型: 插座,母形插口
连接器类型: 高速
位置数: 120
加载位置的数目: 全部
间距: 0.098"(2.50mm)
行数: 8
列数: 10
安装类型: 板边缘,通孔,直角
端子: 压配式
触点布局,典型: 80 单信号,40 接地
特点: 屏蔽
包装: 管件
额定电流: 0.600A
材料可燃性额定值: UL94 V-0
工作温度: -65°C ~ 105°C
额定电压: 250V
配套产品: 6469002-1-ND - CONN HEADER 80POS 8ROW VERT HM
其它名称: A104048
114-- 13059
B. Guide Modules and Pins
The guides modules and pins are recommended for multi--connector, large and heavy daughter card
applications and conditions where misalignment tolerances (given in Paragraph 3.7,A) cannot be met.
3.4. PC Board Requirements
A. Material and Thickness
Right--angle receptacles and pin headers require a daughter card having a minimum thickness of 1.40.
The maximum allowable thickness is 3.5. A special pin header is required for a daughter card thicker than
3.5 (contact PRODUCT INFORMATION at the number at the bottom of page 1 for recommendation). For
suitability of other daughter card thicknesses, contact PRODUCT INFORMATION at the number at the
bottom of page 1.
Vertical receptacles and pin headers require a minimum backplane thickness of 1.40 to allow for positive
retention of the compliant pin contacts. Midplane applications require a minimum backplane thickness of
3.8. Thicker backplanes will not effect the retention of the compliant pin contact.
NOTE
For circuit routing concerns, contact PRODUCT INFORMATION at the number at the bottom of page 1.
i
B. Layout
The pc board hole pattern for the placement of these connectors is provided in Figure 3. Datums and
basic dimensions are established by the customer.
Recommended PC Board Layouts
Daughter Card for HM--Zd Connectors
(See Figure 4)
Backplane for HM--Zd Connectors
Figure 3 (Cont’d)
4 of 21
Rev M
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