参数资料
型号: 2065883-1
厂商: TE Connectivity
文件页数: 9/21页
文件大小: 0K
描述: CONN RCPT 60POS 6ROW RT ANG HM-Z
特色产品: Z-Pack HM-Zd Plus
标准包装: 20
系列: Z-PACK HM-Zd
连接器用途: 子板
连接器类型: 插座,母形插口
连接器类型: 高速
位置数: 90
加载位置的数目: 全部
间距: 0.098"(2.50mm)
行数: 6
列数: 10
安装类型: 板边缘,通孔,直角
端子: 压配式
触点布局,典型: 60 信号,30 接地
特点: 屏蔽
包装: 管件
额定电流: 0.600A
材料可燃性额定值: UL94 V-0
工作温度: -65°C ~ 105°C
额定电压: 250V
配套产品: A104057-ND - CONN HEADER 60POS VERT 6ROWS T/H
其它名称: A104050
114-- 13059
Detail A
HM- Zd and HM- Zd Plus Connectors
1.40 Min Thick Daughter Card or Backplane
3.8 Min Thick Backplane (Required for Midplane Applications)
Detail B
HM- Zd and HM- Zd Plus Connectors
Back- Drilled (PTH Counterboring)
3.5 Max Thick Daughter Card (Special Pin Header Required for Daughter Card
Thicker Than 3.5
Contact TE Engineering for Specific Information)
1.40 Min
“C”
Pad Diameter
“A”
Drilled Hole Before Plating
DIMENSION
“B”
Finished Hole After Plating
DIMENSION D
0.025--0.050
Copper Plating Thickness
“D” Surface Finish
CONNECTOR
A
B
(Nominal)
C
SURFACE FINISH
THICKNESS
HM--Zd HM--Zd Plus
Connector Connector
Hot Air Solder Leveling (HASL)
Tin--lead (Sn Pb)
0.004--0.010
0.0037--0.0123
HM--Zd
0.675--0.725
0.61
1.00
Immersion Tin (Sn)
0.0005--0.004
Organic Solderability Preservative (OSP)
0.0002--0.0005
HM--Zd Plus
0.53--0.57
0.46
0.92
(Signal)
0.80
(Ground)
Immersion Gold (Au) Over Nickel (Ni)
(ENIG)
Immersion Silver (Ag)
0.0001--0.0005 Au
0.00127--0.0076 Ni
0.0001--0.0005
Tolerance or acceptable range of finished hole diameter is the sum of the plated through hole component tolerances.
All component tolerances must be achieved.
Min Finished Diameter = A (Min) -- 2 x Copper Thickness (Max) -- 2 x D (Max)
Max Finished Diameter = A (Max) -- 2 x Copper Thickness (Min) -- 2 x D (Min)
Figure 4
D. Placement
Location of the connector placement on the pc board in relationship to the keying guide modules and pins
shall be as shown in Figure 5.
Connectors can be mounted end--to--end within specified spacing given in Figure 6.
Rev M
9 of 21
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