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参数资料
| 型号： | 20MT120UFP |
| 厂商： | VISHAY INTERTECHNOLOGY INC |
| 元件分类： | IGBT 晶体管 |
| 英文描述： | 40 A, 1200 V, N-CHANNEL IGBT |
| 封装： | ROHS COMPLIANT, MTP, 16 PIN |
| 文件页数： | 5/11页 |
| 文件大小： | 311K |
| 代理商： | 20MT120UFP |
Document Number: 94505
For technical questions, contact: indmodules@vishay.com
www.vishay.com
Revision: 01-Mar-10
3
20MT120UFP
"Full Bridge" IGBT MTP
(Ultrafast NPT IGBT), 40 A
Vishay High Power Products
DIODE SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
Diode forward voltage drop
VFM
IC = 20 A
-
2.48
2.94
V
IC = 40 A
-
3.28
3.90
IC = 20 A, TJ = 125 °C
-
2.44
2.84
IC = 40 A, TJ = 125 °C
-
3.45
4.14
IC = 20 A, TJ = 150 °C
-
2.21
2.93
Reverse recovery energy of the diode
Erec
VGE = 15 V, Rg = 5
Ω, L = 200 μH
VCC = 600 V, IC = 20 A
TJ = 125 °C
-
420
630
μJ
Diode reverse recovery time
trr
-
98
150
ns
Peak reverse recovery current
Irr
-33
50
A
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
Operating junction temperature range
TJ
- 40
-
150
°C
Storage temperature range
TStg
- 40
-
125
Junction to case
IGBT
RthJC
-
0.35
0.52
°C/W
Diode
-
0.40
0.61
Case to sink per module
RthCS
Heatsink compound thermal conductivity = 1 W/mK
-
0.06
-
Clearance
External shortest distance in air between 2 terminals
5.5
-
mm
Creepage
Shortest distance along external surface of the
insulating material between 2 terminals
8-
-
Mounting torque
A mounting compound is recommended and the
torque should be checked after 3 hours to allow for
the spread of the compound. Lubricated threads.
3 ± 10 %
Nm
Weight
66
g
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相关代理商/技术参数 |
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|---|---|
| 20MT120UFPBF | 制造商:Vishay Semiconductors 功能描述:IGBT MODULE FULL BRIDGE |
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| 20MV1 | 功能描述:电源线滤波器 .250 20A FILTER FLANGE MOUNT RoHS:否 制造商:EPCOS 电压额定值:277 VAC 电流额定值:100 A 安装风格:Chassis 端接类型:Screw |
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| 20Mx2-254mm | 功能描述:集管和线壳 2.54MM 0.1" 20-PIN DUAL ROW MALE HEADER RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
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