参数资料
型号: 25LC256T-E/MF
厂商: Microchip Technology
文件页数: 17/26页
文件大小: 0K
描述: IC EEPROM 256KBIT 10MHZ 8DFN
标准包装: 3,300
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 256K (32K x 8)
速度: 10MHz
接口: SPI 3 线串行
电源电压: 2.5 V ~ 5.5 V
工作温度: -40°C ~ 125°C
封装/外壳: 8-VDFN 裸露焊盘
供应商设备封装: 8-DFN-S(6x5)
包装: 带卷 (TR)
25AA256/25LC256
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
b
h
h
α
A
A1
A2
φ
L
c
Units
L1
β
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
1.27 BSC
MAX
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
h
L
L1
φ
c
b
α
β
1.25
0.10
0.25
0.40
0.17
0.31
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
? 2007 Microchip Technology Inc.
DS21822F-page 17
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