参数资料
型号: 2SK4006-01S
厂商: FUJI ELECTRIC CO LTD
元件分类: JFETs
英文描述: 9 A, 900 V, 1.58 ohm, N-CHANNEL, Si, POWER, MOSFET
封装: LEAD FREE, SMD, TPACK-3
文件页数: 4/21页
文件大小: 441K
代理商: 2SK4006-01S
DW
G.
NO
.
H04-004-03
MS5F6095
12 / 21
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Fuji Electric Device Technology Co.,Ltd.
Before touching a MOSFET terminal, discharge any static electricity from your body and clothes by
grounding out through a high impedance resistor (about 1M
)
When soldering, in order to protect the MOSFETs from static electricity, ground the soldering iron or
soldering bath through a low impedance resistor.
You must design the MOSFETs to be operated within the specified maximum ratings(voltage, current,
temperature, etc.) to prevent possible failure or destruction of devices.
Consider the possible temperature rise not only for the channel and case, but also for the outer leads.
Do not directly touch the leads or package of the MOSFETs while power is supplied or during operation
in order to avoid electric shock and burns.
The MOSFETs are made of incombustible material. However, if a MOSFET fails, it may emit smoke or
flame. MOSFETs become hotter during operation. Hence, operating the MOSFETs near any flammable
place or material is unadvisable. Design the arrangement to prevent the spread of fire.
The MOSFETs should not used in an environment in the presence of acid, organic matter, or corrosive
gas(hydrogen sulfide, sulfurous acid gas etc.)
The MOSFETs should not used in an irradiated environment since they are not radiation-proof.
Installation / Through-Hole Package
Soldering involves temperatures which exceed the device storage temperature rating. To avoid device
damage and to ensure reliability, observe the following guidelines from the quality assurance standard.
The immersion depth of the lead should basically be up to the lead stopper and the distance should be a
maximum of 1.5mm from the device.
When flow-soldering, be careful to avoid immersing the package in the solder bath.
Soldering temperature and duration (through-hole package)
Solder temperature
Immersion time
260
5 C
10
1 seconds
350
10 C
3.5
0.5 seconds
Soldering methods (through-hole package)
Methods
Packages
Wave
Soldering
(Full dipping)
Wave
Soldering
(Only terminal)
Infrared
Reflow
Air
Reflow
Soldering
iron
(Re-work)
TO-3PL
TO-3P
TO-247
TO-3PF
TO-220
TO-220F
T-Pack(L)
TO-3PL-7
Possible
Limited to 1 time
Unable
相关PDF资料
PDF描述
2SK4028 10 mA, N-CHANNEL, Si, SMALL SIGNAL, JFET
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