参数资料
| 型号： | 37208-62M3-004 |
| 厂商： | 3M |
| 文件页数： | 13/32页 |
| 文件大小： | 0K |
| 描述： | MINI CLAMP SOCKET 8 POS. 2 ROW |
| 标准包装： | 1 |
| 系列： | 372 |
| 连接器类型： | 插座 |
| 触点类型：： | 母形插口 |
| 位置数： | 8 |
| 加载位置的数目： | 全部 |
| 间距： | 0.079"（2.00mm） |
| 行数： | 2 |
| 行间距： | 0.256"（6.50mm） |
| 安装类型： | 通孔 |
| 端子： | 焊接 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 8µin（0.20µm） |
| 颜色： | 黑 |
| 包装： | 散装 |
| 其它名称： | Q5164959 |
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3M ? DEVICE-TO-BOARD
CONNECTOR SOLUTIONS
PRODUCT
CF CARD HEADERS, COMPACTFLASH ?
SERIES N7E50
CF CARD EJECTORS, COMPACTFLASH ?
SERIES 7E50
SERIAL ATTACHED SCSI
(SAS) CONNECTORS
SERIES SBR AND SBH
SERIAL ADVANCED TECHNOLOGY
ATTACHMENT (SATA) CONNECTORS
SERIES 5607 AND 5622
3M.com/interconnects
FEATURES
? ROHS COMPLIANT
? Headers for Both Type
I and II Cards
? Wide Array of Connector
Size Options to Balance
Between Footprint Size
and Functionality
? ROHS COMPLIANT
? Mates to Selected N7E50
Series CF Headers to Provide
Added Ejection Functionality
? Multiple Button Styles and
Orientations Allow
Design Flexibility
? ROHS COMPLIANT
? 6.0 Gbps Input/Output Connector
for Backplane Applications
? Two Contact Mating Levels for
Early-Mate and Late-Break
Allows “Blind Mating” or “Hot Swap”
Applications
? Capable of Accepting SFF-Compliant
HDD Fitted with SAS or Serial
Advanced Technology Attachment
(SATA) Header
OPTIONS
? Elevated Receptacle Version for
Additional Backplane Stand-off
? Plated Through-Hole, Press-Fit or
SMT Available
? Right Angle Version Available
? 29-Position Device Plugs for Drive
Interface
? 29-Position Combo with Power
? ROHS COMPLIANT
? 3 Gbps I/O Connector
for HDD Applications
? EMLB Contacts for Hot Swap
? Blind Mate Polarization
? Meets SATA 2.6 Specifications
OPTIONS
? Plated Through-Hole, Press-Fit or
SMT Available
? Extended Height Receptacles for
Additional Backplane Standoff
? Right Angle Surfacemount
Receptacle
? 7-Pin Signal Plug
? 22-Position Device Plugs for Drive
Interface
? 22-Position Combo wih Power
MATERIALS
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 2.03 μm [ 80 μ"] Nickel
Wiping Area: 0.38 μm
[ 15 μ" ] or 0.76 μm [ 30 μ" ] Gold
Button
Material: Glass-Filled High
Temperature Thermoplastic
FRAME
Material: Stainless Steel
FLAMMABILITY UL 94V-0
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50 μ" [1.27 μm] Nickel
Wiping Area: 30 μ" [0.76 μm] Gold
Solder Tails: 100 μ" [ 2.54 μm ] Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50 μ"
[ 1.27 μm ] Nickel
Wiping Area: 30 - 40 μ"
[ 0.76 μm ] Gold
Solder Tails: 100 μ"
[ 2.54 μm ] Tin
PERFORMANCE
CURRENT RATING: 0.5 A
TEMPERATURE RATING: -40°C to +85°C
PROCESS RATING: 260°C (per J-STD-020C)
CURRENT RATING:
Power Pin: 1.5 A
Signal Pin: 500 mA
TEMPERATURE RATING: -40°C to +85°C
CURRENT RATING:
Power Pin: 1.5 A
Signal Pin: 500 mA
TEMPERATURE RATING:
Operating Temperature: 0°C to +55°C
Non-Operating Temperature: -40°C to +85°C
13
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