参数资料
| 型号： | 37208-62M3-004 |
| 厂商： | 3M |
| 文件页数： | 6/32页 |
| 文件大小： | 0K |
| 描述： | MINI CLAMP SOCKET 8 POS. 2 ROW |
| 标准包装： | 1 |
| 系列： | 372 |
| 连接器类型： | 插座 |
| 触点类型：： | 母形插口 |
| 位置数： | 8 |
| 加载位置的数目： | 全部 |
| 间距： | 0.079"（2.00mm） |
| 行数： | 2 |
| 行间距： | 0.256"（6.50mm） |
| 安装类型： | 通孔 |
| 端子： | 焊接 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 8µin（0.20µm） |
| 颜色： | 黑 |
| 包装： | 散装 |
| 其它名称： | Q5164959 |
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3M ? BOARDMOUNT CONNECTOR SOLUTIONS
PRODUCT
PIN STRIP HEADERS
SERIES 95X
BOARDMOUNT PIN STRIPS
AND SOCKETS
2 MM, SERIES 95X
BOX HEADERS
2 MM X 2 MM, SOLDER TAIL
SERIES 957
SOCKETS AND PIN STRIP
HEADERS, .100" X .100"
SERIES 929
POLARIZED BOARDMOUNT
SOCKETS, .100" X .100"
SERIES 5100, 6800, 8500, 9100
SOCKETS AND PIN STRIP
HEADERS, 2 MM X 2 MM
SERIES 15
6
FEATURES
? ROHS COMPLIANT
? Single and Dual Row
? 3 - 80 Positions
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Maximizes Use of PC Board Space
? End Stackable Feature
? Mates with Boardmount and
Wiremount Products
? Available in Straight, Right Angle
Through-Hole and Surfacemount
Versions
? ROHS COMPLIANT
? Maximizes Use of PC Board Space
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Dual Row Design, 4–80 Pins
? Minimized PC Board
Stacking Heights
? Mates With Pin Strip Header
Products
? Available in Straight, Right Angle
Through-Hole, Through-Board and
Surfacemount Versions
? ROHS COMPLIANT
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Maximizes Use of PC Board Space
? Center Slot Polarization
Prevents Mis-Insertions and
Reduces Insertion Time
? 10 - 68 Positions
? ROHS COMPLIANT VERSION AVAILABLE
? 2-72 Positions
? Single- and Dual-Row Options
? Through-Hole and Through-Board
Options
? Customizable Stack Heights
from .150" to 1.325"
? High Temperature Insulator Option
? ROHS COMPLIANT
? 10-64 Positions
? Vertical and Right Angle Options
? Center Bump Polarization
? ROHS COMPLIANT VERSION AVAILABLE
? 4-60 Positions
? Single and Dual-Row Options
? Surfacemount, Through-Hole
and Through-Board Options
? Customizable Stack Heights
from .101" to 1.418"
? High Temperature Insulator
MATERIALS
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[ 100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ’" ] Matte Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ" ] Matte Tin
CONTACT
Material: Square Pin 0.5 mm,
Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[ 100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ" ] Matte Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled Polyester
(PBT) or PCT (RoHS Compliant)
FLAMMABILITY UL 94V-0
PLATING
Pin Strip Underplating: 50 μ"
[ 1.27 μm ] Nickel, Interface: 10 μ"
[ 0.25 μm ] or 30 μ" [ 0.76 μm ] Gold
Socket Underplating: 100 μ"
[ 2.54 mm ] Nickel, Interface: 10 μ"
[ 0.25 μm ] or 30 μ" [ 0.76 μm ] Gold
Tin Plated Versions Available
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled Polyester
FLAMMABILITY UL 94V-0
PLATING
Underplating: 2 μm [ 79 μ" ] Nickel
Wiping Area: 0.3 μm [ 12 μ" ] Gold
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled PCT
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50-150 μ"
[ 1.27-3.81 μm ] Nickel
Wiping Area: 30 μ" [ 0.76 μm ] Gold
PERFORMANCE
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A, 2 A or 2.5 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -55°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -55°C to +105°C
3M.com/interconnects
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