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参数资料
| 型号： | 4431-T-B1 D 470 |
| 厂商： | Silicon Laboratories Inc |
| 文件页数： | 5/47页 |
| 文件大小： | 799K |
| 描述： | KIT DEV TEST EZRADIOPRO SI4431 |
| 标准包装： | 1 |
| 附件类型： | 测试卡，收发器，470MHz |
| 适用于相关产品： | EZRadioPRO? |
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Si4430/31/32-B1
Rev 1.1
5
LIST OF FIGURES
Figure 1. Si4430/31 RX/TX Direct-Tie Application Example .....................................................16
Figure 2. Si4432 Antenna Diversity Application Example .........................................................16
Figure 3. SPI Timing..................................................................................................................18
Figure 4. SPI TimingREAD Mode..........................................................................................19
Figure 5. SPI TimingBurst Write Mode ..................................................................................19
Figure 6. SPI TimingBurst Read Mode..................................................................................19
Figure 7. State Machine Diagram..............................................................................................20
Figure 8. TX Timing...................................................................................................................24
Figure 9. RX Timing ..................................................................................................................24
Figure 10. Frequency Deviation ................................................................................................28
Figure 11. Sensitivity at 1% PER vs. Carrier Frequency Offset ................................................29
Figure 12. FSK vs GFSK Spectrums.........................................................................................32
Figure 13. Direct Synchronous Mode Example.........................................................................35
Figure 14. Direct Asynchronous Mode Example.......................................................................35
Figure 15. Microcontroller Connections.....................................................................................36
Figure 16. PLL Synthesizer Block Diagram...............................................................................38
Figure 17. FIFO Thresholds ......................................................................................................41
Figure 18. Packet Structure.......................................................................................................42
Figure 19. Multiple Packets in TX Packet Handler....................................................................43
Figure 20. Required RX Packet Structure with Packet Handler Disabled.................................43
Figure 21. Multiple Packets in RX Packet Handler....................................................................43
Figure 22. Multiple Packets in RX with CRC or Header Error...................................................44
Figure 23. Operation of Data Whitening, Manchester Encoding, and CRC ..............................46
Figure 24. Manchester Coding Example...................................................................................46
Figure 25. Header .....................................................................................................................48
Figure 26. POR Glitch Parameters............................................................................................50
Figure 27. General Purpose ADC Architecture .........................................................................52
Figure 28. Temperature Ranges using ADC8...........................................................................54
Figure 29. WUT Interrupt and WUT Operation..........................................................................57
Figure 30. Low Duty Cycle Mode ..............................................................................................58
Figure 31. RSSI Value vs. Input Power.....................................................................................61
Figure 32. TX/RX Direct-Tie Reference DesignSchematic....................................................62
Figure 33. 20-Pin Quad Flat No-Lead (QFN) ............................................................................69
Figure 34. PCB Land Pattern ....................................................................................................70
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 4431-T-B1D868 | 制造商:Silicon Laboratories Inc 功能描述:One tied antenna Tx/Rx test card 868MHz |
| 4432 | 制造商:3M Electronic Products Division 功能描述:DOUBLE COATED VINYL FOAM TAPE, BLACK, 1/4" X 72 YD 1/32" |
| 44320-01-445-1 | 制造商:UNBRANDED 功能描述:IC SOCKET +0.1UF 20WAY |
| 443204-000 | 制造商:TE Connectivity 功能描述:ST63-5-00 - Bulk |
| 4432-1"X72YDS-WHITE | 功能描述:胶带 DBL COATED VINYL FM 1X72YDS WHITE RoHS:否 制造商:3M Electronic Specialty 产品:Tapes 类型:Shielding 描述/功能:EMI/RFI Foil Shielding Tape 颜色: 材料:Copper Foil 宽度:1 in x 18 yds |
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