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参数资料
| 型号： | 450-0017 |
| 厂商： | LS Research LLC |
| 文件页数： | 23/40页 |
| 文件大小： | 0K |
| 描述： | MODULE SIFLEX02 WIRE ANTENNA |
| 特色产品： | SiFLEX Wireless Module |
| 标准包装： | 50 |
| 系列： | ModFlex™ |
| 频率： | 915MHz |
| 数据传输率 - 最大： | 1Mbps |
| 调制或协议： | 802.15.4 Zigbee |
| 应用： | 通用 |
| 功率 - 输出： | 250mW |
| 灵敏度： | -102dBm |
| 电源电压： | 2 V ~ 3.45 V |
| 电流 - 接收： | 30mA |
| 电流 - 传输： | 285mA |
| 数据接口： | 用于引脚的垫片 |
| 存储容量： | 256kB 闪存，16kB SRAM |
| 天线连接器： | 板载，导线天线 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 模块 |
| 包装： | 托盘 |
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SiFLEX02 TRANSCEIVER MODULE
DATASHEET
CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the SiFLEX02 modules are
delivered in trays of 25.
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Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
Handling
The SiFLEX02 modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may damage the module
permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
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Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
The product shall be stored without opening the
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
The information in this document is subject to change without notice.
330-0009-R3.1
Copyright ? 2009-2012 LS Research, LLC
Page 23 of 40
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 450-0018 | 功能描述:Zigbee/802.15.4模块 SiFLEX02 Zigbee Mod 900 Mhz helical ant RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| 450001800 | 制造商:Amphenol PCD 功能描述:HARDWARE PACKAGE - Bulk |
| 450-0019 | 功能描述:Zigbee/802.15.4模块 SiFLEX02 Module RF Castellation RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| 45-0001-BR | 制造商:DATACOMM ELECTRONICS 功能描述:CABLE PASS THROUGH WALL PLATE RECESSED IN WALL BROWN |
| 45-0001-LA | 制造商:DATACOMM ELECTRONICS 功能描述:CABLE PASS THROUGH WALL PLATE RECESSED IN WALL LT ALMOND |
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