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参数资料
| 型号： | 450-0017 |
| 厂商： | LS Research LLC |
| 文件页数： | 5/40页 |
| 文件大小： | 0K |
| 描述： | MODULE SIFLEX02 WIRE ANTENNA |
| 特色产品： | SiFLEX Wireless Module |
| 标准包装： | 50 |
| 系列： | ModFlex™ |
| 频率： | 915MHz |
| 数据传输率 - 最大： | 1Mbps |
| 调制或协议： | 802.15.4 Zigbee |
| 应用： | 通用 |
| 功率 - 输出： | 250mW |
| 灵敏度： | -102dBm |
| 电源电压： | 2 V ~ 3.45 V |
| 电流 - 接收： | 30mA |
| 电流 - 传输： | 285mA |
| 数据接口： | 用于引脚的垫片 |
| 存储容量： | 256kB 闪存，16kB SRAM |
| 天线连接器： | 板载，导线天线 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 模块 |
| 包装： | 托盘 |
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SiFLEX02 TRANSCEIVER MODULE
DATASHEET
Recommended Reflow Profile for Lead Free Solder ............................................................................. 22
CLEANING ......................................................................................................................... 23
OPTICAL INSPECTION ..................................................................................................... 23
REWORK ........................................................................................................................... 23
SHIPPING, HANDLING, AND STORAGE ......................................................................... 23
Shipping ..................................................................................................................................................... 23
Handling ..................................................................................................................................................... 23
Moisture Sensitivity Level (MSL) ............................................................................................................. 23
Storage ....................................................................................................................................................... 23
Repeating Reflow Soldering .................................................................................................................... 24
AGENCY STATEMENTS ................................................................................................... 25
ANTENNA INFORMATION ................................................................................................ 29
Wire Antenna (Perpendicular to Board as in Figure 16) ....................................................................... 29
Helical Antenna ......................................................................................................................................... 30
MECHANICAL DATA......................................................................................................... 31
PCB Footprint ............................................................................................................................................ 31
General Module Dimensions .................................................................................................................... 32
Module with Wire Antenna ....................................................................................................................... 33
Module with Helical Antenna ................................................................................................................... 34
COMPATIBILITY ................................................................................................................ 35
MODULE REVISION HISTORY ......................................................................................... 36
Rev 1.0 ........................................................................................................................................................ 36
Rev 1.1 ........................................................................................................................................................ 36
Rev 1.3 ........................................................................................................................................................ 37
Rev 2.0 ........................................................................................................................................................ 38
Rev 3.0 ........................................................................................................................................................ 39
CONTACTING LS RESEARCH ......................................................................................... 40
The information in this document is subject to change without notice.
330-0009-R3.1
Copyright ? 2009-2012 LS Research, LLC
Page 5 of 40
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 450-0018 | 功能描述:Zigbee/802.15.4模块 SiFLEX02 Zigbee Mod 900 Mhz helical ant RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| 450001800 | 制造商:Amphenol PCD 功能描述:HARDWARE PACKAGE - Bulk |
| 450-0019 | 功能描述:Zigbee/802.15.4模块 SiFLEX02 Module RF Castellation RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| 45-0001-BR | 制造商:DATACOMM ELECTRONICS 功能描述:CABLE PASS THROUGH WALL PLATE RECESSED IN WALL BROWN |
| 45-0001-LA | 制造商:DATACOMM ELECTRONICS 功能描述:CABLE PASS THROUGH WALL PLATE RECESSED IN WALL LT ALMOND |
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