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参数资料
| 型号： | 504-AG10D |
| 厂商： | THOMAS BETTS CORP |
| 元件分类： | 插座 |
| 英文描述： | DIP4, IC SOCKET |
| 文件页数： | 2/2页 |
| 文件大小： | 33K |
| 代理商： | 504-AG10D |
H
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
Need more technical information?
Consult your Thomas & Betts
sales office listed on the back cover
H11
Part
Number
504-AG10D
504-AG11D
504-AG12D
504-AG10F
504-AG11F
Number of
Contacts
4
Contact
Plating
Gold
Tin/Lead
Gold
Sleeve
Plating
Gold
Tin/Lead
Gold
Tin/Lead
Termination
Style
Printed
Circuit
Solderless
Wire Wrap
PART NUMBER / STANDARD CONFIGURATIONS
504-AG11D
.180
(4,75)
Max.
.700
(17,78)
Max.
.300
(7,62)
.400
(10,16)
.445
(11,30)
Max.
Contacts on
.100
(2,54)
Centers Typ.
.093 (2,36) Dia thru hole
.183 (4,65) Dia. ‘C” bore
x
.083 (2,11) deep
(2 places)
.135
(3,43)
Max.
.600
(15,24)
Max.
.020
± .003
(0,51
± 0,08)
.053
±.003
(1,35
±0,08)
.510
±.010
(12,95
±0,25)
.110
(2,79)
Min.
.025
(0,64)
Sq. Typ.
500 Series
Crystal Oscillator Sockets
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 200 Grams (7.1 oz.) average with .018" (0,46)
dia. polished steel pin
Inner Contact
Retention .................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic ..................... 3.0 Lbs. per line minimum
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. 179 Grams (6.3 oz.) average with a
.018" (0,46) dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55
°C to +125°C
Tin/lead inner contact -55
°C to +105°C
FEATURES:
Accommodates any component leads with .016" to .021"
(0,41 x 0,53) diameter
Withstands most severe environmental conditions including military
requirements of high shock and vibration
Low profile
Contact features closed end construction eliminating any solder or flux
wicking problems
Two-piece tapered entry socket terminal features a four-finger, inner
contact and machined outer sleeve
APPLICATION DIMENSIONS:
PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
PCB Hole Size Range:
.035"
± .003" (0,89 ± 0,08) PC tail,
.055"
± .003" (1,40 ± 0,08) solderless wrap
IC Pin Dimension Range: .016" to .021" (0,41 to 0,53) round lead,
.105"(2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Inner Contact .................. Four-fingered beryllium copper,
gold over nickel plated
Outer Sleeve .................. Machined brass, gold over nickel or
tin/lead over copper plated
相关PDF资料 |
PDF描述 |
|---|---|
| 504-AG12D | DIP4, IC SOCKET |
| 504-AG11F | DIP4, IC SOCKET |
| 504-AG10F | DIP4, IC SOCKET |
| 504-AG12D | DIP4, IC SOCKET |
| 506-AG10D-ES | DIP6, IC SOCKET |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 504-AG11D | 功能描述:IC 与器件插座 PC MOUNT 4 PIN 340 RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 504-AG12D | 制造商:TE Connectivity 功能描述: |
| 504B | 制造商:未知厂家 制造商全称:未知厂家 功能描述:InGaN LED Lamps |
| 504B3A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Bi-Color Dual Chip LED |
| 504B-8SK | 制造商: 功能描述: 制造商:undefined 功能描述: |
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