收藏本站
参数资料
型号： 534002B02554G
厂商： Aavid Thermalloy
文件页数： 68/116页
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
产品培训模块： How to Select a Heat Sink
标准包装： 500
类型： 插件板级，垂直
冷却式包装： TO-220
固定方法： 夹和 PC 引脚
形状： 矩形
长度： 2.000"（50.80mm）
宽： 1.375"（34.93mm）
机座外的高度（散热片高度）： 0.500"（12.70mm）
温升时的功耗： 2W @ 30°C
在强制气流下的热敏电阻： 在 400 LFM 时为5°C/W
自然环境下的热电阻： 9°C/W
材质： 铝
材料表面处理： 黑色阳极化处理
其它名称： 001943
534002B02554
534002B02554-ND
55
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5330, 5331, 5332, 5333 Extruded heat sink with radial fins
Extruded heat sink with radial
fins and clip attach feature
makes device attachment easy.
Includes two solderable mounting
pins which permit vertical mount-
ing and eliminate stress on device
leads. Available in four heights for
TO-220, TO-218 and TO-247 devices.
39.10
(1.540)
6.60
(0.260)
13.50
(0.530)
25.40
(1.000)
2x
2.36
(0.093)
2x
3.96
(0.156)
3.18
(0.125)
0.64
(0.025)
"A"
"B"
NOTCH
FOR CLIP 2x
34.92
(1.375)
12.70
(0.500)
DITTIN
HIGH
X
"C"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
53310X
53300X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
533001B02551G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533002B02551G
TO-220
25.40 (1.000)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533101B02551G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533102B02551G
TO-220
38.10 (1.500)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533201B02551G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533202B02551G
TO-220
50.80 (2.000)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533301B02551G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533302B02551G
TO-220
63.50 (2.500)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—
°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
53330X
53320X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—
°C
For additional options see page 83
CLIP 51
5304
High rise style heat sink features staggered fins and Wave-On
TM solderable mounts
High rise style heat sink features
staggered fins and Wave-On
TM
solderable mounts for easy attach-
ment to the PC card. Models include
thru holes on one side to attach
devices using standard hardware
and dittins with special slots on the
other for easy device attachment
using a convenient spring clip.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
Device
“A” Dim
530401B00100G
High rise style heat sink staggered fins
TO-218, TO-247
21.08 (0.830)
4.75 (0.187)
530401B00150G
With device clip #50
TO-218, TO-247
21.08 (0.830)
4.75 (0.187)
530402B00100G
High rise style heat sink staggered fins
TO-220
18.29 (0.720)
4.75 (0.187)
530402B00150G
With device clip #50
TO-220
18.29 (0.720)
4.75 (0.187)
ORDERING INFORMATION
24.13
(0.950)
44.45
(1.750)
3.20
(0.126)
THRU
7.49
(0.295)
"A"
2.54
(0.100)
12.45
(0.490)
19.05
(0.750)
2.79
(0.110)
0.76
(0.030)
44.45
(1.750)
x
HIGH
7.62
(0.300)
10.16
(0.400)
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
1.57
(0.060)
2.54
(0.100)
DITTIN
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
CLIP 50
For additional options see page 82
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相关PDF资料
PDF描述
P08-026SLC-B-G CONN SOCKET 26POS .8MM VERT SMD
DFNA2-1T5 RES ARRAY MULT OHM 4 RES 8-VDFN
172501-1 MIC MARK-2 PLUG HSG 21P
AXK6S70647YG CONN HEADER BRD/BRD .5MM 70POS
AXK6S70547YG CONN HEADER BRD/BRD .5MM 70POS
相关代理商/技术参数
参数描述
53-4003-0527 功能描述:印刷电路板和试验板 SOLDER MASK 1 GALLON RoHS:否 制造商:3M Electronic Solutions Division 产品:Jumper & Insulated Wires 描述/功能:Jumper wire, 22 AWG 0.1 inch 长度:0.1 in 宽度:
53-4003-0533 制造商:ITW Chemtronics 功能描述:1 GAL PEELABLE SOLDER MASK
53400399 制造商:Cooper Hand Tools / Weller 功能描述:WD1 POWER UNIT 制造商:WELLER 功能描述:WD1 POWER UNIT
53-4004-0533 功能描述:TC533 TECHFORM PEELABLE SOLDER M 制造商:techspray 系列:* 零件状态:在售 标准包装:1
534008-1 功能描述:高速/模块连接器 100P TBC RECP ASY 392 RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*