收藏本站
参数资料
型号： 534002B02554G
厂商： Aavid Thermalloy
文件页数： 70/116页
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
产品培训模块： How to Select a Heat Sink
标准包装： 500
类型： 插件板级，垂直
冷却式包装： TO-220
固定方法： 夹和 PC 引脚
形状： 矩形
长度： 2.000"（50.80mm）
宽： 1.375"（34.93mm）
机座外的高度（散热片高度）： 0.500"（12.70mm）
温升时的功耗： 2W @ 30°C
在强制气流下的热敏电阻： 在 400 LFM 时为5°C/W
自然环境下的热电阻： 9°C/W
材质： 铝
材料表面处理： 黑色阳极化处理
其它名称： 001943
534002B02554
534002B02554-ND
57
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
7.62
(0.300)
16.51
(0.650)
25.65
(1.01)
REF
6.60
(0.260)
2.39
(0.093)
3.96
(0.156)
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
25.40
(1.000)
"B"
"A"
3.18 (0.125)
X 0.64 (0.025)
HIGH DITTIN
2x
A
3.17
(0.125)
VIEW A-A
SINGLE HEAT SINK DEVICE
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
VIEW A-A
DUAL HEAT SINK DEVICE
12.70
(0.500)
13.72
(0.540)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
5334XX
5335XX
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Extruded heat sink with large
radial fins and channel clip
attach feature makes device
attachment easy. Includes clip
and two solderable mounting
pins which permit vertical
mounting and eliminate stress
on device leads. Available in
four heights for TO-220, TO-218,
and TO-247 devices.
5334, 5335, 5336, 5337 Extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
Description
“A” Dim
“B” Dim
533401B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
533402B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
533421B02552G
Dual TO-218, TO-247
With 2 device clips #52
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
533422B02552G
Dual TO-220
With 2 device clips #52
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
533501B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
533502B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
533521B02552G
Dual TO-218, TO-247
With 2 device clips #52
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
533522B02552G
Dual TO-220
With 2 device clips #52
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
533601B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
63.50 (2.500)
21.59 (0.850)
2.67 (0.105)
533602B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
63.50 (2.500)
18.29 (0.720)
2.67 (0.105)
533621B02552G
Dual TO-218, TO-247
With 2 device clips #52
63.50 (2.500)
21.59 (0.850)
2.67 (0.105)
533622B02552G
Dual TO-220
With 2 device clips #52
63.50 (2.500)
18.29 (0.720)
2.67 (0.105)
533701B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
533702B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
533721B02552G
Dual TO-218, TO-247
With 2 device clips #52
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
533722B02552G
Dual TO-220
With 2 device clips #52
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
5336XX
5337XX
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
For additional options see page 83
CLIP 52
Grease
Epoxy
&
page112
SEE NOTE 1
NOTE 1: Graph depicts single device models. Dual device models
exhibit a 15% performance increase.
相关PDF资料
PDF描述
P08-026SLC-B-G CONN SOCKET 26POS .8MM VERT SMD
DFNA2-1T5 RES ARRAY MULT OHM 4 RES 8-VDFN
172501-1 MIC MARK-2 PLUG HSG 21P
AXK6S70647YG CONN HEADER BRD/BRD .5MM 70POS
AXK6S70547YG CONN HEADER BRD/BRD .5MM 70POS
相关代理商/技术参数
参数描述
53-4003-0527 功能描述:印刷电路板和试验板 SOLDER MASK 1 GALLON RoHS:否 制造商:3M Electronic Solutions Division 产品:Jumper & Insulated Wires 描述/功能:Jumper wire, 22 AWG 0.1 inch 长度:0.1 in 宽度:
53-4003-0533 制造商:ITW Chemtronics 功能描述:1 GAL PEELABLE SOLDER MASK
53400399 制造商:Cooper Hand Tools / Weller 功能描述:WD1 POWER UNIT 制造商:WELLER 功能描述:WD1 POWER UNIT
53-4004-0533 功能描述:TC533 TECHFORM PEELABLE SOLDER M 制造商:techspray 系列:* 零件状态:在售 标准包装:1
534008-1 功能描述:高速/模块连接器 100P TBC RECP ASY 392 RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*