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| 型号： | 587-1792-KIT |
| 厂商： | Taiyo Yuden |
| 文件页数： | 29/31页 |
| 文件大小： | 0K |
| 描述： | KIT INDUCTOR HI FREQ 0603 SMD |
| 标准包装： | 1 |
| 系列： | HK |
| 套件类型： | 固定 |
| 值： | 270 件 - 1.5nH ~ 220nH，各 10 件 |
| 安装类型： | 表面贴装 |
| 包括封装： | 0603（1608 公制） |
| 产品目录页面： | 1822 (CN2011-ZH PDF) |
| 工具箱内容： | (10) 587-1561-1-ND - INDUCTOR HI FREQ 220NH 5% 0603 (10) 587-1560-1-ND - INDUCTOR HI FREQ 180NH 5% 0603 (10) 587-1559-1-ND - INDUCTOR HI FREQ 150NH 5% 0603 (10) 587-1558-1-ND - INDUCTOR HI FREQ 120NH 5% 0603 (10) 587-1557-1-ND - INDUCTOR HI FREQ 100NH 5% 0603 (10) 587-1556-1-ND - INDUCTOR HI FREQ 82NH 5% 0603 (10) 587-1555-1-ND - INDUCTOR HI FREQ 68NH 5% 0603 (10) 587-1554-1-ND - INDUCTOR HI FREQ 56NH 5% 0603 (10) 587-1553-1-ND - INDUCTOR HI FREQ 47NH 5% 0603 (10) 587-1552-1-ND - INDUCTOR HI FREQ 39NH 5% 0603 更多... |
| 其它名称： | 587-1792 587-1792-ND Q6035083 TAIYO-HK1608-V1 |
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3. Considerations for automatic placement
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
Precautions
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Single-sided mounting
Improper method
chipping
or cracking
Proper method
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Technical
considerations
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
［Recommended conditions］
Amount of adhesives
After inductors are bonded
Figure
0805 case sizes as examples
a a
a 0.3mm min
b 100～120μm
c Area with no adhesive
b
c
c
4. Soldering
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
Precautions
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E02R01
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