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参数资料
| 型号： | 5962-0720801VXC |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | ADC |
| 英文描述： | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP84 |
| 封装： | CERAMIC, CFP-84 |
| 文件页数： | 3/20页 |
| 文件大小： | 681K |
| 代理商： | 5962-0720801VXC |
www.ti.com
Thermal Characteristics
(1)
SGLS378 – MARCH 2008
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
NO.
AIN
17
Differential input signal (positive)
AIN
18
Differential input signal (negative)
4, 9, 14, 15, 20, 23,
AVDD5
Analog power supply (5 V)
25, 27, 29, 33
Analog power supply (3.3 V) (Suggestion for 250 MSPS: leave option to connect to 5 V for
AVDD3
37, 39, 41
ADS5440/4 compatibility)
DVDD3
2, 54, 70
Output driver power supply (3.3 V)
1, 3, 8, 10, 13, 16,
19, 21, 22, 24, 26,
GND
28, 30, 32, 34, 36,
Ground
38, 40, 42, 43, 55,
64, 69
CLK
11
Differential input clock (positive). Conversion initiated on rising edge.
CLK
12
Differential input clock (negative)
D0, D0
56, 57
LVDS digital output pair, least-significant bit (LSB)
D1-D3,
58–63
LVDS digital output pair
D1-D3
D4–D5,
65–68
LVDS digital output pairs
D4–D5
D6–D10,
71–80
LVDS digital output pairs
D6–D10
D11, D11
81, 82
LVDS digital output pair, most-significant bit (MSB)
DRY, DRY
83, 84
Data ready LVDS output pair
No connect (5 and 6 should be left floating, 46–53 are possible future bit additions for this pinout
NC
5–6, 46–53
and therefore can be connected to a digital bus or left floating)
Overrange indicator LVDS output. A logic high signals an analog input in excess of the full-scale
OVR, OVR
44, 45
range.
RESERVED
31, 35
Reserved for possible future control features
VREF
7
Reference voltage
PARAMETER
TEST CONDITIONS
TYP
UNIT
RθJA
Junction-to-free-air thermal resistance
Junction-to-case thermal resistance
21.81
°C/W
RθJC
Junction-to-case thermal resistance
MIL-STD-883 Test Method 1012
0.849
°C/W
(1)
This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package.
To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly
underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package
is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it
that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI
typically recommends an 11,9 mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads
away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device
within recommended operating conditions. This pad must be electrically at ground potential.
Copyright 2008, Texas Instruments Incorporated
11
Product Folder Link(s) :ADS5463-SP
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