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参数资料
| 型号： | 5962-0721901VHA |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 运算放大器 |
| 英文描述： | OP-AMP, 6000 uV OFFSET-MAX, CDFP10 |
| 封装： | CERAMIC, DFP-10 |
| 文件页数： | 12/22页 |
| 文件大小： | 830K |
| 代理商： | 5962-0721901VHA |
www.ti.com
5
6
7
8
9
10
V
S–
DISSIPATION RATINGS
ABSOLUTE MAXIMUM RATINGS
(1)
SGDS038A – SEPTEMBER 2007 – REVISED OCTOBER 2007
These devices have limited built in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
U PACKAGE
TOP VIEW
NC – No internal connection
ORDERING INFORMATION(1)
TRANSPORT MEDIA,
PACKAGED DEVICES
PACKAGE TYPE(2)
PACKAGE MARKINGS
QUANTITY
5962-0721901VHA
Ceramic Flatpack
0721901VHA
Tubes, 25
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
POWER RATING(1)
θJC
θJA
PACKAGE
(
°C/W)
(
°C/W)
TA ≤ 25°C
TA = 85°C
TA = 125°C
U (10)
14.7
189
661 mW
344 mW
132 mW
(1)
Power rating determined for a maximum junction temperature of 150
°C. However, distortion starts to substantially increase above
125
°C. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance
and long-term reliability.
over operating free-air temperature range (unless otherwise noted)
UNIT
VS
Supply voltage
+6.0 V
VI
Input voltage
±VS
IO
Output current
150 mA
VID
Differential input voltage
±2 V
Continuous power dissipation
See Dissipation Rating Table
TJ
Maximum junction temperature, any condition(2)
150
°C
Tstg
Storage temperature range
–65
°C to 150°C
HBM
1600 V
ESD Ratings
CDM
1000 V
MM
100 V
(1)
The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2)
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
2
Copyright 2007, Texas Instruments Incorporated
Product Folder Link(s): THS4304-SP
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