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参数资料
型号： 5962-0824504HYA
厂商： MICROSS COMPONENTS
元件分类： PROM
英文描述： 2M X 32 FLASH 3V PROM, 70 ns, CPGA66
封装： HERMETIC SEALED, CERAMIC, HIP-66
文件页数： 1/29页
文件大小： 361K
代理商： 5962-0824504HYA
FLASH
AS8FLC2M32
AS8FLC2M32B
Rev. 1.5 02/10
Micross Components reserves the right to change products or specications without notice.
1
FIGURE 1: PIN ASSIGNMENT
(Top View)
Hermetic, Multi-Chip Module
(MCM)
64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array
Available via Applicable Specications:
MIL-PRF-38534, Class H
DSCC SMD 5962-08245
FEATURES
64Mb device, total density, organized as 2M x 32
Bottom Boot Block (Sector) Architecture
(Contact factory for top boot)
Operation with single 3.0V Supply
Available in multiple Access time variations
Individual byte control via individual byte selects (CSx\)
Low Power CMOS
1,000,000 Erase/Program Cycles
Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
Sector Architecture:
One 16K byte, two 8K byte, one 32K byte and
thirty-one 64Kbyte sectors (byte mode)
Any combination of sectors can be concurrently erased
MCM supports full array (multi-chip) Erase
Embedded Erase and Program Algorithms
Erase Suspend/Resume; Supports reading data from or
programming data to a sector not being Erased
TTL Compatible Inputs and Outputs
Military and Industrial operating temperature ranges
OPTION
MARKING
Access Speed
70ns*
-70
90ns
-90
100ns
-100
120ns
-120
*Contact Factory
Package
Ceramic Quad Flat Pack
Q
Ceramic Hex Inline Pack
P
Temperature Range
Full Mil (MIL-PRF-38534, Class H /Q
Military Temp (-55oC to +125oC)
/XT
Industrial (-40oC to +85oC)
/IT
GENERAL DESCRIPTION
The AS8FLC2M32B is a 64Mb FLASH Multi-Chip Module
organized as 2M x 32 bits. The module achieves high speed
access, low power consumption and high reliability by employ-
ing advanced CMOS memory technology. The military grade
product is manufactured in compliance to the MIL-PRF-38534
specications, making the AS8FLC2M32B ideally suited for
military or space applications. The module is offered in a
68-lead 0.990 inch square ceramic quad at pack or 66-lead
1.185inch square ceramic Hex In-line Package (HIP). The
CQFP package design is targeted for those applications, which
require low prole SMT Packaging.
For more products and information
please visit our web site at
www.micross.com
I/O0
I/O1
I/02
I/O5
I/O6
I/O7
GND
I/O10
I/O11
I/O17
I/O18
I/O21
I/O22
I/O23
GND
I/O26
I/O27
I/O16
I/O19
I/O25
I/O20
I/O24
I/O28
I/O30
I/O29
I/O3
I/O9
I/O4
I/O8
10
11
12
13
14
15
16
17
18
09
08
07
06
05
04
03
02
01
68
67
66
65
64
63
62
61
60
59
78
57
76
55
54
53
52
51
50
49
48
47
46
45
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
I/012
I/O14
I/O13
25
24
23
22
21
19
20
VC
C
A1
0
A8
A7
A6
WE
1\
CS
4
\
GN
D
CS
3
\
A5
A4
A3
A2
A1
A0
A9
RE
S
E
T
\
VCC
A1
1
A1
2
A1
3
A1
4
A1
5
CS1
\
OE
\
CS
2
\
A1
7
WE
2
\
WE
3
\
WE
4
\
A1
8
A1
9
NC
A1
6
26
44
I/O15
I/O31
[Package Designator QT]
I/O2
I/O1
I/O0
I/O8
I/O9
I/O10
I/O4
I/O3
I/O5
I/O6
I/O7
I/O11
I/O12
I/O13
I/O14
I/O15
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
A0
A18
A11
A16
A14
A15
A9
A10
A17
A8
A7
A4
A5
A6
A1
A2
A3
A12
A13
NC
CS3\
CS2\
CS1\
CS4\
A19
VCC
GND
Reset\
OE\
WE\
NC
66 HIP
Pin Assignment
[Package Designator H]
(Top View)
P
DQ8
DQ9
DQ10
DQ0
DQ1
DQ2
DQ11
DQ3
DQ15
DQ14
DQ13
A20
DQ12
DQ7
DQ6
DQ5
DQ4
DQ24
DQ25
DQ26
DQ27
DQ31
DQ30
DQ29
DQ19
DQ28
DQ23
DQ22
DQ21
DQ20
DQ16
DQ17
DQ18
DQ25
DQ24
DQ23
DQ22
DQ21
DQ20
DQ19
DQ18
DQ17
DQ16
DQ31
DQ30
DQ29
DQ28
DQ27
DQ26
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
A20
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