参数资料
型号: 73M1922-DB
厂商: Maxim Integrated Products
文件页数: 80/82页
文件大小: 0K
描述: BOARD DEMO 73M1922 20-TSSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
主要目的: *
嵌入式:
已用 IC / 零件: *
主要属性: *
次要属性: *
已供物品: 板,CD
DS_1x22_017
73M1822/73M1922 Data Sheet
Rev. 1.6
81
16 Ordering Information
Table 49 lists the order numbers and packaging marks used to identify 73M1822 and 73M1922 products.
Table 49: Order Numbers and Packaging Marks
Part Description
Order Number
Packaging Mark
Host/Line
73M1922 32-Pin QFN, Lead free
73M1922-IM/F
73M1912-M
73M1902-M
Line-Side IC
Host-Side IC
73M1922 32-Pin QFN, Lead free,
Tape and Reel
73M1922-IMR/F
73M1912-M
73M1902-M
Line-Side IC
Host-Side IC
73M1922 20-Pin TSSOP, Lead free
73M1922-IVT/F
73M1912VT
73M1902A
Line-Side IC
Host-Side IC
73M1922 20-Pin TSSOP, Lead free
Tape and Reel
73M1922-IVTR/F
73M1912VT
73M1902A
Line-Side IC
Host-Side IC
73M1822 42-Pin QFN, Lead free
73M1822-IM/F
73M1822A-IM
73M1822 42-Pin QFN, Lead free,
Tape and Reel
73M1822-IMR/F
73M1822A-IM
17 Contact Information
For more information about Teridian Semiconductor products or to check the availability of the 73M1822 or
73M1922, contact us at:
6440 Oak Canyon Road
Suite 100
Irvine, CA 92618-5201
Telephone: (714) 508-8800
FAX: (714) 508-8878
Email: modem.support@teridian.com
For a complete list of worldwide sales offices, go to http://www.teridian.com.
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