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参数资料
| 型号： | 73S8009R-IMR/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 4/23页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD LEVEL SHIFT 20-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 4,000 |
| 应用： | 智能卡读取器，写入器 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VFQFN 裸露焊盘 |
| 供应商设备封装： | 20-QFN（4x4） |
| 包装： | 带卷 (TR) |
73S8009R Data Sheet
DS_8009R_056
Figures
Figure 1: 73S8009R Block Diagram ......................................................................................................... 2
Figure 2: 73S8009R 20-Pin QFN Pinout .................................................................................................. 5
Figure 3: 73S8009R 28-Pin SO Pinout ..................................................................................................... 5
Figure 4: Typical 73S8009R Application Schematic ............................................................................... 13
Figure 5: Activation Sequence ............................................................................................................... 15
Figure 6: Deactivation Sequence ........................................................................................................... 16
Figure 7: OFF Activity Outside and Inside a Card Session ..................................................................... 17
Figure 8: Power-down Operation ........................................................................................................... 17
Figure 9: CS Timing Definitions.............................................................................................................. 18
Figure 10: I/O and I/OUC State Diagram ................................................................................................ 19
Figure 11: I/O to I/OUC Delay Timing Diagram....................................................................................... 19
Figure 12: 20-pin QFN Package Dimensions ......................................................................................... 20
Figure 13: 28-Pin SO Package Dimensions ........................................................................................... 21
Tables
Table 1: 73S8009R Pin Definitions .......................................................................................................... 6
Table 2: Absolute Maximum Device Ratings ............................................................................................ 8
Table 3: Recommended Operating Conditions ......................................................................................... 8
Table 4: DC Smart Card Interface Requirements ..................................................................................... 9
Table 5: Digital Signals Characteristics .................................................................................................. 11
Table 6: DC Characteristics ................................................................................................................... 11
Table 7: Voltage / Temperature Fault Detection Circuits ......................................................................... 12
Table 8: Choice of VCC Pin Capacitor ................................................................................................... 15
Table 9: Order Numbers and Packaging Marks ...................................................................................... 22
4
Rev. 1.3
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| 73S8010C | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Smart Card Interface |
| 73S8010C-DB | 功能描述:界面开发工具 73S8010C Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8010C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8010C-ILR/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8010C-IM/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
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