参数资料
型号: 74AHCT74
厂商: NXP Semiconductors N.V.
英文描述: Dual D-type flip-flop with set and reset; positive-edge trigger(带置位和复位的双D触发器;上升沿触发;)
中文描述: 双D型触发器设置和复位触发器,积极边缘触发器(带置位和复位的双?触发器,上升沿触发;)
文件页数: 17/20页
文件大小: 92K
代理商: 74AHCT74
1999 Sep 23
17
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74AHC74; 74AHCT74
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
相关PDF资料
PDF描述
74AHC86 Quad 2-input EXCLUSIVE-OR gate(四2输入异或门)
74AHCT86 Quad 2-input EXCLUSIVE-OR gate(四2输入异或门)
74AHC86PWDH Quadruple 2-Input Positive-NAND Gates With Open-Drain Outputs 14-TSSOP -40 to 85
74AHCT86PWDH Triple 3-Input Positive-NAND Gates 14-SOIC -40 to 85
74AHCT00 Quad 2-input NAND gate(四 2输入与非门)
相关代理商/技术参数
参数描述
74AHCT74BQ 制造商:NXP Semiconductors 功能描述:IC DUAL D F-F POS EDGE DHVQ
74AHCT74BQ,115 功能描述:触发器 DUAL D-TYPE FLIPFLOP RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
74AHCT74BQ-G 功能描述:触发器 DUAL D-TYPE FLIPFLOP RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
74AHCT74BQ-Q100X 制造商:NXP Semiconductors 功能描述:74AHCT74BQ-Q100/DHVQFN14/REEL7 - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC D-TYPE POS TRG DUAL 14DHVQFN
74AHCT74D 功能描述:触发器 DUAL D-TYPE FLIPFLOP RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel