- 您现在的位置：买卖IC网 > PDF目录360417 > 74ALVCH32501EC (NXP SEMICONDUCTORS) 36-bit universal bus transceiver with direction pin; 5 V tolerant; 3-state PDF资料下载
参数资料
| 型号： | 74ALVCH32501EC |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 通用总线功能 |
| 英文描述： | 36-bit universal bus transceiver with direction pin; 5 V tolerant; 3-state |
| 中文描述： | ALVC/VCX/A SERIES, DUAL 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PBGA114 |
| 封装： | 16 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-537-1, LFBGA-114 |
| 文件页数： | 14/16页 |
| 文件大小： | 88K |
| 代理商： | 74ALVCH32501EC |
2000 Mar 16
14
Philips Semiconductors
Product specification
36-bit universal bus transceiver with direction pin;
5 V tolerant; 3-state
74ALVCH32501
SOLDERING
Introduction to soldering surface mount packages
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
°
C. The top-surface temperature of the
packages should preferable be kept below 230
°
C.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°
C.
相关PDF资料 |
PDF描述 |
|---|---|
| 74ALVCHS162830 | 18-bit to 36-bit address driver with bus hold (3-State) |
| 74ALVCHS162830DGB | 18-bit to 36-bit address driver with bus hold (3-State) |
| 74alvchs16830 | 3-Line To 8-Line Decoders/Demultiplexers 16-PDIP -40 to 85 |
| 74ALVT162240 | 16-bit inverting buffer/driver with 30 Ωtermination resistors (3-State)(带30 Ω终端电阻器的16位反相缓冲器/驱动器(三态）) |
| 74ALVT162241 | 2.5V/3.3V 16-bit buffer/driver with 30 Ωtermination resistors (3-State)(带30 Ω终端电阻器的2.5V/3.3V 16位缓冲器/驱动器(三态）) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 74ALVCH32501EC,518 | 功能描述:IC UNIV BUS TXRX 26BIT 114LFBGA RoHS:是 类别:集成电路 (IC) >> 逻辑 - 通用总线函数 系列:74ALVCH 产品变化通告:Product Discontinuation 09/Dec/2010 标准包装:1,500 系列:74AVC 逻辑类型:通用总线驱动器 输入数:- 电路数:18 位 输出电流高，低:12mA，12mA 电源电压:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:56-TFSOP（0.240"，6.10mm 宽） 供应商设备封装:56-TSSOP 包装:带卷 (TR) |
| 74ALVCH32501EC,551 | 功能描述:IC UNIV BUS TXRX 26BIT 114LFBGA RoHS:是 类别:集成电路 (IC) >> 逻辑 - 通用总线函数 系列:74ALVCH 产品变化通告:Product Discontinuation 09/Dec/2010 标准包装:1,500 系列:74AVC 逻辑类型:通用总线驱动器 输入数:- 电路数:18 位 输出电流高，低:12mA，12mA 电源电压:1.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:56-TFSOP（0.240"，6.10mm 宽） 供应商设备封装:56-TSSOP 包装:带卷 (TR) |
| 74ALVCH32501EC,557 | 功能描述:总线收发器 36-BIT UNIVERSAL BUS TRAN, 3-S RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
| 74ALVCH32501ZKFR | 功能描述:通用总线函数 36B Univ Bus Trnscvr RoHS:否 制造商:Texas Instruments 逻辑类型:CMOS 逻辑系列:74VMEH 电路数量:1 开启电阻（最大值）: 传播延迟时间:10.1 ns 电源电压-最大:3.45 V 电源电压-最小:3.15 V 最大工作温度:+ 85 C 最小工作温度:0 C 封装 / 箱体:TSSOP-48 封装:Reel |
| 74ALVCH32973EC,518 | 功能描述:IC TRANSCVR 16BIT 96LFBGA 制造商:nexperia usa inc. 系列:* 零件状态:最後搶購 标准包装:3,500 |
发布紧急采购，3分钟左右您将得到回复。